MPC5553 Series
Manufacturer: NXP USA Inc.
NXP 32-BIT MCU, POWER ARCH, 1.5MB FLASH, 132MHZ, -40/+125DEGC, AUTOMOTIVE GRADE, PBGA 324 ROHS COMPLIANT: YES
| Part | Voltage - Supply (Vcc/Vdd) Minimum | Voltage - Supply (Vcc/Vdd) Maximum | RAM Size Depth | RAM Size Width | Program Memory Size | Program Memory Depth | Program Memory Width | Core Processor | Package / Case | Core Size (Bit Width) | Peripherals | A/D Channels | A/D Resolution (bits) | Connectivity | Mounting Type | Package Width | Package Name | Package Length | Oscillator Type | Operating Temperature (Max) | Operating Temperature (Min) | Number of I/O | Speed | Program Memory Type | Core Configuration |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | 1.35 V | 1.65 V | 64 K | 8 bit | 1.5 MB | 1.5 M | 8 bit | e200z6 | 324-BBGA | 32 Bit | DMA POR PWM WDT | 40 count | 12 bit | CANbus EBI EMI Ethernet SCI SPI | Surface Mount | 23 mm | 324-PBGA | 23 mm | External | 125 °C | -40 °C | 220 | 132 MHz | FLASH | Single-Core |
NXP USA Inc. | 1.35 V | 1.65 V | 64 K | 8 bit | 1.5 MB | 1.5 M | 8 bit | e200z6 | 416-BBGA | 32 Bit | DMA POR PWM WDT | 40 count | 12 bit | CANbus EBI EMI Ethernet SCI SPI | Surface Mount | 27 mm | 416-PBGA | 27 mm | External | 125 °C | -40 °C | 220 | 132 MHz | FLASH | Single-Core |
NXP USA Inc. | 1.35 V | 1.65 V | 64 K | 8 bit | 1.5 MB | 1.5 M | 8 bit | e200z6 | 416-BBGA | 32 Bit | DMA POR PWM WDT | 40 count | 12 bit | CANbus EBI EMI Ethernet SCI SPI | Surface Mount | 27 mm | 416-PBGA | 27 mm | External | 125 °C | -40 °C | 220 | 132 MHz | FLASH | Single-Core |