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26-1508-31

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Aries Electronics

CONN IC DIP SOCKET 26POS GOLD

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26-1508-31

Active
Aries Electronics

CONN IC DIP SOCKET 26POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification26-1508-31
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post10 çin
Contact Finish Thickness - Post0.25 çm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesClosed Frame
Housing MaterialPolyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationWire Wrap
Termination Post Length0.5 in
Termination Post Length12.7 mm
TypeDIP
Type5.08 mm
Type0.2 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 25$ 16.03

Description

General part information

26-1508 Series

26 (2 x 13) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources