26-1508 Series

Catalog

CONN IC DIP SOCKET 26POS GOLD

Part	Housing Material	Contact Finish - Post	Type	Type	Type	Material Flammability Rating	Contact Finish - Mating	Current Rating (Amps)	Termination	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Features	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 26-1508-31	Polyamide (PA46) Nylon 4/6	Gold	DIP	5.08 mm	0.2 in	UL94 V-0	Gold	3 A	Wire Wrap	Through Hole	10 çin	0.25 çm	Beryllium Copper	10 çin	0.25 çm	-55 °C	125 °C	0.1 in	2.54 mm	Brass	Closed Frame	0.5 in	12.7 mm	2.54 mm	0.1 in
Aries Electronics 26-1508-21	Polyamide (PA46) Nylon 4/6	Gold	DIP	5.08 mm	0.2 in	UL94 V-0	Gold	3 A	Wire Wrap	Through Hole	10 çin	0.25 çm	Beryllium Copper	10 çin	0.25 çm	-55 °C	125 °C	0.1 in	2.54 mm	Brass	Closed Frame			2.54 mm	0.1 in	0.36 in	9.14 mm
Aries Electronics 26-1508-30	Polyamide (PA46) Nylon 4/6	Tin	DIP	5.08 mm	0.2 in	UL94 V-0	Gold	3 A	Wire Wrap	Through Hole	10 çin	0.25 çm	Beryllium Copper	200 µin	5.08 µm	-55 °C	105 ░C	0.1 in	2.54 mm	Brass	Closed Frame	0.5 in	12.7 mm	2.54 mm	0.1 in