Specification	MC705C8ACBE

Connectivity	SCI, SPI
Core Processor	HC05
Core Size (Bit Width)	8 Bit
Mounting Type	Through Hole
Number of I/O	24
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package Length	0.6 in
Package Name	42-SDIP, 42-PDIP
Package Width	15.24 mm
Peripherals	POR, WDT
Program Memory Depth	8 K
Program Memory Size	8 KB
Program Memory Type	OTP
Program Memory Width	8 bit
RAM Size Depth	304
RAM Size Width	8 bit
Speed	2.1 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	3 V

MC705 Series

Part	Program Memory Type	Operating Temperature (Min)	Operating Temperature (Max)	Core Size (Bit Width)	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	Package Name	Package Width	Package Length	RAM Size Width	RAM Size Depth	Speed	Core Processor	Mounting Type	Program Memory Depth	Program Memory Size	Program Memory Width	EEPROM Size (Width)	EEPROM Size (Depth)	A/D Resolution (bits)	A/D Channels	Number of I/O	Connectivity	Peripherals	Oscillator Type	Package / Case
NXP USA Inc. MC705B16NBE	OTP	0 °C	70 °C	8 Bit	5.5 V	4.5 V	56-PSDIP 56-SDIP	15.24 mm	0.6 in	8 bit	352	2.1 MHz	HC05	Through Hole	15 K	15 KB	8 bit	8 bit	256	8 bit	8 count	32	SCI	POR WDT	Internal
NXP USA Inc. MC705J1ACDWE	OTP	-40 °C	85 °C	8 Bit	5.5 V	3 V	20-SOIC	7.5 mm	0.295 in	8 bit	64	4 MHz	HC05	Surface Mount	1.2 K	1.2 KB	8 bit					14		POR WDT	Internal
NXP USA Inc. MC705P6ACPE	OTP	-40 °C	85 °C	8 Bit	5.5 V	3 V	28-DIP 28-PDIP	15.24 mm	0.6 in	8 bit	176	2.1 MHz	HC05	Through Hole	4.5 K	4.5 KB	8 bit			8 bit	4 count	21	SIO	POR WDT	Internal
NXP USA Inc. MC705C8ACFBE	OTP	-40 °C	85 °C	8 Bit	5.5 V	3 V	44-QFP	10 mm	10 mm	8 bit	304	2.1 MHz	HC05	Surface Mount	8 K	8 KB	8 bit					24	SCI SPI	POR WDT	Internal	44-QFP
NXP USA Inc. MC705L16CFUE	OTP	-40 °C	85 °C	8 Bit	5.5 V	3 V	80-QFP	14 mm	14 mm	8 bit	512	2.1 MHz	HC05	Surface Mount	16 K	16 KB	8 bit					16	SPI	LCD POR WDT	Internal	80-QFP
NXP USA Inc. MC705C8ACBE	OTP	-40 °C	85 °C	8 Bit	5.5 V	3 V	42-PDIP 42-SDIP	15.24 mm	0.6 in	8 bit	304	2.1 MHz	HC05	Through Hole	8 K	8 KB	8 bit					24	SCI SPI	POR WDT	Internal
NXP USA Inc. MC705JP7CPE	OTP	-40 °C	85 °C	8 Bit	5.5 V	2.7 V	28-DIP 28-PDIP	15.24 mm	0.6 in	8 bit	224	2.1 MHz	HC05	Through Hole	6 K	6 KB	8 bit			12 bit	4 count	22	SIO	POR Temp Sensor WDT	Internal
NXP USA Inc. MC705P6ACDWER	OTP	-40 °C	85 °C	8 Bit	5.5 V	3 V	28-SOIC	7.5 mm	0.295 in	8 bit	176	2.1 MHz	HC05	Surface Mount	4.5 K	4.5 KB	8 bit			8 bit	4 count	21	SIO	POR WDT	Internal
NXP USA Inc. MC705B16NCFNER	OTP	-40 °C	85 °C	8 Bit	5.5 V	4.5 V	52-PLCC	19.1 mm	19.1 mm	8 bit	352	2.1 MHz	HC05	Surface Mount	15 K	15 KB	8 bit	8 bit	256	8 bit	8 count	32	SCI	POR WDT	Internal	52-LCC (J-Lead)
NXP USA Inc. MC705C8ABE	OTP	0 °C	70 °C	8 Bit	5.5 V	3 V	42-PDIP 42-SDIP	15.24 mm	0.6 in	8 bit	304	2.1 MHz	HC05	Through Hole	8 K	8 KB	8 bit					24	SCI SPI	POR WDT	Internal

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

MC705C8ACBE | Datasheet