MC705 Series
Manufacturer: NXP USA Inc.
IC MCU 8BIT 15KB OTP 56PSDIP
| Part | Program Memory Type | Operating Temperature (Min) | Operating Temperature (Max) | Core Size (Bit Width) | Voltage - Supply (Vcc/Vdd) Maximum | Voltage - Supply (Vcc/Vdd) Minimum | Package Name | Package Width | Package Length | RAM Size Width | RAM Size Depth | Speed | Core Processor | Mounting Type | Program Memory Depth | Program Memory Size | Program Memory Width | EEPROM Size (Width) | EEPROM Size (Depth) | A/D Resolution (bits) | A/D Channels | Number of I/O | Connectivity | Peripherals | Oscillator Type | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | OTP | 0 °C | 70 °C | 8 Bit | 5.5 V | 4.5 V | 56-PSDIP 56-SDIP | 15.24 mm | 0.6 in | 8 bit | 352 | 2.1 MHz | HC05 | Through Hole | 15 K | 15 KB | 8 bit | 8 bit | 256 | 8 bit | 8 count | 32 | SCI | POR WDT | Internal | |
NXP USA Inc. | OTP | -40 °C | 85 °C | 8 Bit | 5.5 V | 3 V | 20-SOIC | 7.5 mm | 0.295 in | 8 bit | 64 | 4 MHz | HC05 | Surface Mount | 1.2 K | 1.2 KB | 8 bit | 14 | POR WDT | Internal | ||||||
NXP USA Inc. | OTP | -40 °C | 85 °C | 8 Bit | 5.5 V | 3 V | 28-DIP 28-PDIP | 15.24 mm | 0.6 in | 8 bit | 176 | 2.1 MHz | HC05 | Through Hole | 4.5 K | 4.5 KB | 8 bit | 8 bit | 4 count | 21 | SIO | POR WDT | Internal | |||
NXP USA Inc. | OTP | -40 °C | 85 °C | 8 Bit | 5.5 V | 3 V | 44-QFP | 10 mm | 10 mm | 8 bit | 304 | 2.1 MHz | HC05 | Surface Mount | 8 K | 8 KB | 8 bit | 24 | SCI SPI | POR WDT | Internal | 44-QFP | ||||
NXP USA Inc. | OTP | -40 °C | 85 °C | 8 Bit | 5.5 V | 3 V | 80-QFP | 14 mm | 14 mm | 8 bit | 512 | 2.1 MHz | HC05 | Surface Mount | 16 K | 16 KB | 8 bit | 16 | SPI | LCD POR WDT | Internal | 80-QFP | ||||
NXP USA Inc. | OTP | -40 °C | 85 °C | 8 Bit | 5.5 V | 3 V | 42-PDIP 42-SDIP | 15.24 mm | 0.6 in | 8 bit | 304 | 2.1 MHz | HC05 | Through Hole | 8 K | 8 KB | 8 bit | 24 | SCI SPI | POR WDT | Internal | |||||
NXP USA Inc. | OTP | -40 °C | 85 °C | 8 Bit | 5.5 V | 2.7 V | 28-DIP 28-PDIP | 15.24 mm | 0.6 in | 8 bit | 224 | 2.1 MHz | HC05 | Through Hole | 6 K | 6 KB | 8 bit | 12 bit | 4 count | 22 | SIO | POR Temp Sensor WDT | Internal | |||
NXP USA Inc. | OTP | -40 °C | 85 °C | 8 Bit | 5.5 V | 3 V | 28-SOIC | 7.5 mm | 0.295 in | 8 bit | 176 | 2.1 MHz | HC05 | Surface Mount | 4.5 K | 4.5 KB | 8 bit | 8 bit | 4 count | 21 | SIO | POR WDT | Internal | |||
NXP USA Inc. | OTP | -40 °C | 85 °C | 8 Bit | 5.5 V | 4.5 V | 52-PLCC | 19.1 mm | 19.1 mm | 8 bit | 352 | 2.1 MHz | HC05 | Surface Mount | 15 K | 15 KB | 8 bit | 8 bit | 256 | 8 bit | 8 count | 32 | SCI | POR WDT | Internal | 52-LCC (J-Lead) |
NXP USA Inc. | OTP | 0 °C | 70 °C | 8 Bit | 5.5 V | 3 V | 42-PDIP 42-SDIP | 15.24 mm | 0.6 in | 8 bit | 304 | 2.1 MHz | HC05 | Through Hole | 8 K | 8 KB | 8 bit | 24 | SCI SPI | POR WDT | Internal |