28-C212-20

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Aries Electronics

CONN IC DIP SOCKET 28POS GOLD

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Aries Electronics

CONN IC DIP SOCKET 28POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	28-C212-20

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	28
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length	0.04 in
Termination Post Length	1.02 mm
Type	DIP
Type	0.6 in
Type	15.24 mm

Part	Contact Finish - Post	Housing Material	Features	Number of Positions or Pins (Grid)	Contact Material - Post [custom]	Mounting Type	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Type	Type	Type	Material Flammability Rating	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Current Rating (Amps)
Aries Electronics 28-C212-30	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	28	Brass	Through Hole	0.04 in	1.02 mm	2.54 mm	0.1 in	200 µin	5.08 µm	0.1 in	2.54 mm	Gold	DIP	0.6 in	15.24 mm	UL94 V-0	Wire Wrap	10 çin	0.25 çm	Beryllium Copper	105 ░C	-55 °C	3 A
Aries Electronics 28-C212-10T	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	28	Brass	Through Hole	0.125 in	3.18 mm	2.54 mm	0.1 in	200 µin	5.08 µm	0.1 in	2.54 mm		DIP	0.6 in	15.24 mm	UL94 V-0	Solder	200 µin	5.08 µm	Beryllium Copper	105 ░C	-55 °C	3 A
Aries Electronics 28-C212-11	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	28	Brass	Through Hole	0.125 in	3.18 mm	2.54 mm	0.1 in	10 çin	0.25 çm	0.1 in	2.54 mm	Gold	DIP	0.6 in	15.24 mm	UL94 V-0	Solder	10 çin	0.25 çm	Beryllium Copper	125 °C	-55 °C	3 A
Aries Electronics 28-C212-20	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	28	Brass	Through Hole	0.04 in	1.02 mm	2.54 mm	0.1 in	200 µin	5.08 µm	0.1 in	2.54 mm	Gold	DIP	0.6 in	15.24 mm	UL94 V-0	Wire Wrap	10 çin	0.25 çm	Beryllium Copper	105 ░C	-55 °C	3 A

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	23	$ 16.89

General part information

28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources