28-C212 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Termination Post Length	Material Flammability Rating	Current Rating	Pitch - Post	Contact Finish - Mating	Contact Material - Mating	Row Spacing	Type	Housing Material	Contact Finish Thickness - Post	Termination	Pitch - Mating	Contact Finish - Post	Operating Temperature (Min)	Operating Temperature (Max)	Mounting Type	Features	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Material - Post	Contact Finish Thickness - Mating
Aries Electronics 28-C212-30	0.04 in	UL94 V-0	3 A	0.1 in	Gold	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	Wire Wrap	0.1 in	Tin	-55 °C	105 °C	Through Hole	Closed Frame	14	28	2	Brass	10 µin
Aries Electronics 28-C212-10T	0.125 in	UL94 V-0	3 A	0.1 in	Tin	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	Solder	0.1 in	Tin	-55 °C	105 °C	Through Hole	Closed Frame	14	28	2	Brass	200 Ąin
Aries Electronics 28-C212-11	0.125 in	UL94 V-0	3 A	0.1 in	Gold	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Solder	0.1 in	Gold	-55 °C	125 °C	Through Hole	Closed Frame	14	28	2	Brass	10 µin
Aries Electronics 28-C212-20	0.04 in	UL94 V-0	3 A	0.1 in	Gold	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	Wire Wrap	0.1 in	Tin	-55 °C	105 °C	Through Hole	Closed Frame	14	28	2	Brass	10 µin
Aries Electronics 28-C212-31	0.04 in	UL94 V-0	3 A	0.1 in	Gold	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	Wire Wrap	0.1 in	Gold	-55 °C	125 °C	Through Hole	Closed Frame	14	28	2	Brass	10 µin