28-C212 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Contact Finish - Post	Housing Material	Features	Number of Positions or Pins (Grid)	Contact Material - Post [custom]	Mounting Type	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Type	Type	Type	Material Flammability Rating	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Current Rating (Amps)
Aries Electronics 28-C212-30	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	28	Brass	Through Hole	0.04 in	1.02 mm	2.54 mm	0.1 in	200 µin	5.08 µm	0.1 in	2.54 mm	Gold	DIP	0.6 in	15.24 mm	UL94 V-0	Wire Wrap	10 çin	0.25 çm	Beryllium Copper	105 ░C	-55 °C	3 A
Aries Electronics 28-C212-10T	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	28	Brass	Through Hole	0.125 in	3.18 mm	2.54 mm	0.1 in	200 µin	5.08 µm	0.1 in	2.54 mm		DIP	0.6 in	15.24 mm	UL94 V-0	Solder	200 µin	5.08 µm	Beryllium Copper	105 ░C	-55 °C	3 A
Aries Electronics 28-C212-11	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	28	Brass	Through Hole	0.125 in	3.18 mm	2.54 mm	0.1 in	10 çin	0.25 çm	0.1 in	2.54 mm	Gold	DIP	0.6 in	15.24 mm	UL94 V-0	Solder	10 çin	0.25 çm	Beryllium Copper	125 °C	-55 °C	3 A
Aries Electronics 28-C212-20	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	28	Brass	Through Hole	0.04 in	1.02 mm	2.54 mm	0.1 in	200 µin	5.08 µm	0.1 in	2.54 mm	Gold	DIP	0.6 in	15.24 mm	UL94 V-0	Wire Wrap	10 çin	0.25 çm	Beryllium Copper	105 ░C	-55 °C	3 A