32-3552-10

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Aries Electronics

32P DIP TIN BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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32-3552-10

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Aries Electronics

32P DIP TIN BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	32-3552-10

Contact Finish - Post	Tin
Contact Finish Thickness - Mating	5.08 µm
Contact Finish Thickness - Mating	200 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	2 x 16
Number of Positions or Pins (Grid) [custom]	32
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	7.62 mm
Type	0.3 in
Type	DIP, ZIF (ZIP)

32-3552 Series

Part	Contact Finish - Post	Mounting Type	Current Rating (Amps)	Pitch - Post	Pitch - Post	Termination	Type	Type	Type	Termination Post Length	Termination Post Length	Features	Contact Material - Mating	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Housing Material	Contact Material - Post	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 32-3552-11	Gold	Through Hole	1 A	2.54 mm	0.1 in	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Closed Frame	Beryllium Copper	Gold	2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	UL94 V-0	0.1 in	2.54 mm
Aries Electronics 32-3552-10	Tin	Through Hole	1 A	2.54 mm	0.1 in	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Closed Frame	Beryllium Copper		2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	UL94 V-0	0.1 in	2.54 mm	200 µin	5.08 µm	5.08 µm	200 µin
Aries Electronics 32-3552-16	Nickel Boron	Through Hole	1 A	2.54 mm	0.1 in	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Closed Frame	Beryllium Copper	Nickel Boron	2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	UL94 V-0	0.1 in	2.54 mm	50 µin	1.27 µm	1.27 µm	50 µin
Aries Electronics 32-3552-18	Nickel Boron	Through Hole	1 A	2.54 mm	0.1 in	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Closed Frame	Beryllium Nickel	Nickel Boron	2 x 16	32	Polyetheretherketone (PEEK) Glass Filled	Beryllium Nickel	UL94 V-0	0.1 in	2.54 mm	50 µin	1.27 µm	1.27 µm	50 µin	-55 °C	250 °C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	40	$ 13.12
LCSC	Piece	1	$ 30.62
		200	$ 12.22
		496	$ 11.81
		1000	$ 11.61

Description

General part information

32-3552 Series

32 (2 x 16) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Tin Through Hole

Documents

Technical documentation and resources