32-3552 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS GLD

Part	Contact Finish - Post	Mounting Type	Current Rating (Amps)	Pitch - Post	Pitch - Post	Termination	Type	Type	Type	Termination Post Length	Termination Post Length	Features	Contact Material - Mating	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Housing Material	Contact Material - Post	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 32-3552-11	Gold	Through Hole	1 A	2.54 mm	0.1 in	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Closed Frame	Beryllium Copper	Gold	2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	UL94 V-0	0.1 in	2.54 mm
Aries Electronics 32-3552-10	Tin	Through Hole	1 A	2.54 mm	0.1 in	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Closed Frame	Beryllium Copper		2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	UL94 V-0	0.1 in	2.54 mm	200 µin	5.08 µm	5.08 µm	200 µin
Aries Electronics 32-3552-16	Nickel Boron	Through Hole	1 A	2.54 mm	0.1 in	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Closed Frame	Beryllium Copper	Nickel Boron	2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	UL94 V-0	0.1 in	2.54 mm	50 µin	1.27 µm	1.27 µm	50 µin
Aries Electronics 32-3552-18	Nickel Boron	Through Hole	1 A	2.54 mm	0.1 in	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Closed Frame	Beryllium Nickel	Nickel Boron	2 x 16	32	Polyetheretherketone (PEEK) Glass Filled	Beryllium Nickel	UL94 V-0	0.1 in	2.54 mm	50 µin	1.27 µm	1.27 µm	50 µin	-55 °C	250 °C