40-3572-11

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Aries Electronics

40P DIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Aries Electronics

40P DIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Technical Specifications

Parameters and characteristics for this part

Specification	40-3572-11

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Number of Positions or Pins (Grid) [custom]	20
Number of Positions or Pins (Grid) [custom]	2
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	7.62 mm
Type	0.3 in
Type	DIP, ZIF (ZIP)

Part	Contact Finish - Post	Current Rating (Amps)	Contact Material - Mating	Termination Post Length	Termination Post Length	Type	Type	Type	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Material Flammability Rating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Pitch - Post	Pitch - Post	Features	Mounting Type	Termination	Housing Material
Aries Electronics 40-3572-16	Nickel Boron	1 A	Beryllium Nickel	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	Nickel Boron	1.27 µm	50 µin	1.27 µm	50 µin	Beryllium Nickel	UL94 V-0	40	20	2	2.54 mm	0.1 in	Closed Frame	Through Hole	Solder	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 40-3572-11	Gold	1 A	Beryllium Copper	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	Gold	0.25 çm	10 çin	0.25 çm	10 çin	Beryllium Copper	UL94 V-0	40	20	2	2.54 mm	0.1 in	Closed Frame	Through Hole	Solder	Polyphenylene Sulfide (PPS) Glass Filled

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

40 (2 x 20) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources