CONN IC DIP SOCKET ZIF 40POS
| Part | Contact Finish - Post | Current Rating (Amps) | Contact Material - Mating | Termination Post Length | Termination Post Length | Type | Type | Type | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post | Material Flammability Rating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Pitch - Post | Pitch - Post | Features | Mounting Type | Termination | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Nickel Boron | 1 A | Beryllium Nickel | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 0.1 in | 2.54 mm | Nickel Boron | 1.27 µm | 50 µin | 1.27 µm | 50 µin | Beryllium Nickel | UL94 V-0 | 40 | 20 | 2 | 2.54 mm | 0.1 in | Closed Frame | Through Hole | Solder | Polyphenylene Sulfide (PPS) Glass Filled |
Aries Electronics | Gold | 1 A | Beryllium Copper | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 0.1 in | 2.54 mm | Gold | 0.25 çm | 10 çin | 0.25 çm | 10 çin | Beryllium Copper | UL94 V-0 | 40 | 20 | 2 | 2.54 mm | 0.1 in | Closed Frame | Through Hole | Solder | Polyphenylene Sulfide (PPS) Glass Filled |