24-C212-21

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Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

24-C212-21

Active

Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

Description Specifications Series Pricing CAD Documents

Description

General part information

24-C212 Series

24 (2 x 12) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Technical Specifications

Parameters and characteristics for this part

Specification	24-C212-21

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Current Rating	3 A
Features	Closed Frame
Grid Columns	12
Grid Rows	2
Housing Material	Nylon 4/6, Glass Filled, PA46, Polyamide
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	24
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.6 in
Termination	Wire Wrap
Termination Post Length	0.04 in
Type	DIP, 0.6" (15.24mm) Row Spacing

24-C212 Series

Part	Current Rating	Material Flammability Rating	Termination Post Length	Housing Material	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish - Mating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Pitch - Mating	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Features	Row Spacing	Type	Mounting Type	Pitch - Post	Contact Material - Post	Contact Material - Mating	Contact Finish - Post
Aries Electronics 24-C212-11	3 A	UL94 V-0	0.125 in	Glass Filled Nylon 4/6 PA46 Polyamide	125 °C	-55 °C	Gold	2	24	12	0.1 in	Solder	10 µin	10 µin	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP	Through Hole	0.1 in	Brass	Beryllium Copper	Gold
Aries Electronics 24-C212-10	3 A	UL94 V-0	0.125 in	Glass Filled Nylon 4/6 PA46 Polyamide	105 °C	-55 °C	Gold	2	24	12	0.1 in	Solder	10 µin	200 µin	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP	Through Hole	0.1 in	Brass	Beryllium Copper	Tin
Aries Electronics 24-C212-21	3 A	UL94 V-0	0.04 in	Glass Filled Nylon 4/6 PA46 Polyamide	125 °C	-55 °C	Gold	2	24	12	0.1 in	Wire Wrap	10 µin	10 µin	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP	Through Hole	0.1 in	Brass	Beryllium Copper	Gold
Aries Electronics 24-C212-00	3 A	UL94 V-0	0.04 in	Glass Filled Nylon 4/6 PA46 Polyamide	105 °C	-55 °C	Gold	2	24	12	0.1 in	Solder	10 µin	200 µin	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP	Surface Mount	0.1 in	Brass	Beryllium Copper	Tin
Aries Electronics 24-C212-20	3 A	UL94 V-0	0.04 in	Glass Filled Nylon 4/6 PA46 Polyamide	105 °C	-55 °C	Gold	2	24	12	0.1 in	Wire Wrap	10 µin	200 µin	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP	Through Hole	0.1 in	Brass	Beryllium Copper	Tin
Aries Electronics 24-C212-31	3 A	UL94 V-0	0.04 in	Glass Filled Nylon 4/6 PA46 Polyamide	125 °C	-55 °C	Gold	2	24	12	0.1 in	Wire Wrap	10 µin	10 µin	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP	Through Hole	0.1 in	Brass	Beryllium Copper	Gold

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

24-C212-21 | Datasheet