24-C212 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Current Rating	Material Flammability Rating	Termination Post Length	Housing Material	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish - Mating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Pitch - Mating	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Features	Row Spacing	Type	Mounting Type	Pitch - Post	Contact Material - Post	Contact Material - Mating	Contact Finish - Post
Aries Electronics 24-C212-11	3 A	UL94 V-0	0.125 in	Glass Filled Nylon 4/6 PA46 Polyamide	125 °C	-55 °C	Gold	2	24	12	0.1 in	Solder	10 µin	10 µin	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP	Through Hole	0.1 in	Brass	Beryllium Copper	Gold
Aries Electronics 24-C212-10	3 A	UL94 V-0	0.125 in	Glass Filled Nylon 4/6 PA46 Polyamide	105 °C	-55 °C	Gold	2	24	12	0.1 in	Solder	10 µin	200 µin	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP	Through Hole	0.1 in	Brass	Beryllium Copper	Tin
Aries Electronics 24-C212-21	3 A	UL94 V-0	0.04 in	Glass Filled Nylon 4/6 PA46 Polyamide	125 °C	-55 °C	Gold	2	24	12	0.1 in	Wire Wrap	10 µin	10 µin	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP	Through Hole	0.1 in	Brass	Beryllium Copper	Gold
Aries Electronics 24-C212-00	3 A	UL94 V-0	0.04 in	Glass Filled Nylon 4/6 PA46 Polyamide	105 °C	-55 °C	Gold	2	24	12	0.1 in	Solder	10 µin	200 µin	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP	Surface Mount	0.1 in	Brass	Beryllium Copper	Tin
Aries Electronics 24-C212-20	3 A	UL94 V-0	0.04 in	Glass Filled Nylon 4/6 PA46 Polyamide	105 °C	-55 °C	Gold	2	24	12	0.1 in	Wire Wrap	10 µin	200 µin	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP	Through Hole	0.1 in	Brass	Beryllium Copper	Tin
Aries Electronics 24-C212-31	3 A	UL94 V-0	0.04 in	Glass Filled Nylon 4/6 PA46 Polyamide	125 °C	-55 °C	Gold	2	24	12	0.1 in	Wire Wrap	10 µin	10 µin	Closed Frame	0.6 in	0.6" (15.24mm) Row Spacing DIP	Through Hole	0.1 in	Brass	Beryllium Copper	Gold