24-C212 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Features	Material Flammability Rating	Contact Finish - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Pitch - Post	Pitch - Post	Mounting Type	Contact Material - Post [custom]	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Housing Material	Termination	Current Rating (Amps)	Termination Post Length	Termination Post Length	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 24-C212-11	Closed Frame	UL94 V-0	Gold	24	10 çin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	Gold	-55 °C	125 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	3 A	3.18 mm	0.125 in	DIP	0.6 in	15.24 mm	10 çin	0.25 çm
Aries Electronics 24-C212-21	Closed Frame	UL94 V-0	Gold	24	10 çin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	Gold	-55 °C	125 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	Wire Wrap	3 A	1.02 mm	0.04 in	DIP	0.6 in	15.24 mm	10 çin	0.25 çm
Aries Electronics 24-C212-00	Closed Frame	UL94 V-0	Gold	24	10 çin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	2.54 mm	0.1 in	Surface Mount	Brass	Tin	-55 °C	105 ░C	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	3 A	1.02 mm	0.04 in	DIP	0.6 in	15.24 mm	200 µin	5.08 µm
Aries Electronics 24-C212-20	Closed Frame	UL94 V-0	Gold	24	10 çin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	Tin	-55 °C	105 ░C	Glass Filled Nylon 4/6 Polyamide (PA46)	Wire Wrap	3 A	1.02 mm	0.04 in	DIP	0.6 in	15.24 mm	200 µin	5.08 µm
Aries Electronics 24-C212-31	Closed Frame	UL94 V-0	Gold	24	10 çin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	Gold	-55 °C	125 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	Wire Wrap	3 A	1.02 mm	0.04 in	DIP	0.6 in	15.24 mm	10 çin	0.25 çm