
NC2SWLF.015 1LB
ActiveChip Quik Inc.
LF SOLDER WIRE 99.3/0.7 TIN/COPP
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NC2SWLF.015 1LB
ActiveChip Quik Inc.
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | NC2SWLF.015 1LB | 
|---|---|
| Composition | Sn99.3Cu0.7 (99.3/0.7) | 
| Diameter [diameter] | 0.015 in | 
| Diameter [diameter] | 0.38 mm | 
| Flux Type | No-Clean | 
| Form | 16 oz | 
| Form | 1 lb | 
| Form | Spool | 
| Melting Point [custom] | 441 °F | 
| Melting Point [custom] | 227 °C | 
| Type | Wire Solder | 
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 65.31 | |
Description
General part information
NC2SW Series
No-Clean Wire Solder Sn99.3Cu0.7 (99.3/0.7) Spool, 1 lb (453.592g)
Documents
Technical documentation and resources