NC2SW Series

Catalog

SOLDER WIRE MINI POCKET PACK 60/

Part	Form	Form	Type	Process	Flux Type	Composition	Melting Point [Max] [custom]	Melting Point [Min] [custom]	Melting Point [Max] [custom]	Melting Point [Min] [custom]	Wire Gauge	Diameter [diameter]	Diameter [diameter]	Form	Melting Point [custom]	Melting Point [custom]	Melting Point [Max] [custom]	Melting Point [Min] [custom]	Melting Point [Max] [custom]
Chip Quik Inc. NC2SW.020 0.3OZ	0.3 oz 8.51 g	Tube	Wire Solder	Leaded	No-Clean	Sn60Pb40 (60/40)	370 °F	361 °F	188 °C	183 °C	24 AWG 25 mmý	0.51 mm	0.02 in
Chip Quik Inc. NC2SWLF.015 2OZ	56.7 g	Spool	Wire Solder		No-Clean	Sn99.3Cu0.7 (99.3/0.7)						0.38 mm	0.015 in	2 oz	441 °F	227 °C
Chip Quik Inc. NC2SW.015 2OZ	56.7 g	Spool	Wire Solder	Leaded	No-Clean	Sn60Pb40 (60/40)		361 °F				0.38 mm	0.015 in	2 oz			370 °F	183 °C	188 °C
Chip Quik Inc. NC2SWLF.015 8OZ	226.8 g	Spool	Wire Solder		No-Clean	Sn99.3Cu0.7 (99.3/0.7)						0.38 mm	0.015 in	8 oz	441 °F	227 °C
Chip Quik Inc. NC2SWLF.015 0.2OZ	0.2 oz 5.66 g	Tube	Wire Solder		No-Clean	Sn99.3Cu0.7 (99.3/0.7)						0.38 mm	0.015 in		441 °F	227 °C
Chip Quik Inc. NC2SWLF.015 1LB	16 oz	Spool	Wire Solder		No-Clean	Sn99.3Cu0.7 (99.3/0.7)						0.38 mm	0.015 in	1 lb	441 °F	227 °C
Chip Quik Inc. NC2SW.015 1LB	16 oz	Spool	Wire Solder	Leaded	No-Clean	Sn60Pb40 (60/40)		361 °F				0.38 mm	0.015 in	1 lb			370 °F	183 °C	188 °C
Chip Quik Inc. NC2SW.015 0.2OZ	0.2 oz 5.66 g	Tube	Wire Solder	Leaded	No-Clean	Sn60Pb40 (60/40)		361 °F				0.38 mm	0.015 in				370 °F	183 °C	188 °C
Chip Quik Inc. NC2SWLF.015 1OZ	28.35 g	Spool	Wire Solder		No-Clean	Sn99.3Cu0.7 (99.3/0.7)						0.38 mm	0.015 in	1 oz	441 °F	227 °C
Chip Quik Inc. NC2SW.015 4OZ	113.4 g	Spool	Wire Solder	Leaded	No-Clean	Sn60Pb40 (60/40)		361 °F				0.38 mm	0.015 in	4 oz			370 °F	183 °C	188 °C