
NX3008CBKS,115
ActiveNexperia USA Inc.
30 / 30 V, 350 / 200 MA N/P-CHANNEL TRENCH MOSFET

NX3008CBKS,115
ActiveNexperia USA Inc.
30 / 30 V, 350 / 200 MA N/P-CHANNEL TRENCH MOSFET
Description
General part information
NX3008 Series
Complementary N/P-channel enhancement mode Field-Effect Transistor (FET) in very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | NX3008CBKS,115 |
|---|---|
| Configuration | N, P-Channel |
| Current - Continuous Drain (Id) (Maximum) | 200 mA |
| Current - Continuous Drain (Id) (Typical) | 350 mA |
| Drain to Source Voltage (Vdss) | 30 V |
| FET Feature | Logic Level Gate |
| Gate Charge (Max) | 0.68 nC |
| Grade | Automotive |
| Input Capacitance (Ciss) (Max) | 50 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 6-TSSOP, SC-88, SOT-363 |
| Package Name | 6-TSSOP |
| Power - Max | 445 mW |
| Qualification | AEC-Q101 |
| Rds On (Max) | 1.4 Ohm |
| Technology | MOSFET (Metal Oxide) |
| Vgs(th) (Max) | 1.1 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Wave soldering profile
Questions about package outline drawings
plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body
Failure signature of Electrical Overstress on Power MOSFETs
Understanding power MOSFET data sheet parameters
TSSOP6; Reel pack for SMD, 7"; Q2/T3 product orientation
Nexperia package poster
Power MOSFET frequently asked questions and answers
Using power MOSFETs in parallel
RC Thermal Models
Power MOSFET single-shot and repetitive avalanche ruggedness rating
MAR_SOT363 Topmark
Understanding power MOSFET data sheet parameters
Low temperature soldering, application study
PicoGate leaded logic portfolio guide
LFPAK MOSFET thermal design guide - Part 2
LFPAK MOSFET thermal design guide, Chinese version
plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body
Reflow soldering profile