
APF30-30-13CB
ActiveTusonix a Subsidiary of CTS Electronic Components
HEATSINK LOW-PROFILE FORGED
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APF30-30-13CB
ActiveTusonix a Subsidiary of CTS Electronic Components
HEATSINK LOW-PROFILE FORGED
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | APF30-30-13CB |
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Fin Height [z] | 12.7 mm |
| Fin Height [z] | 0.5 in |
| Length [x] | 30 mm |
| Length [x] | 1.181 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | ASIC, BGA, LGA, CPU |
| Shape | Square, Fins |
| Thermal Resistance @ Forced Air Flow | 200 LFM, 2.5 °C/W |
| Type | Top Mount |
| Width | 30 mm |
| Width | 1.181 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Box | 1 | $ 5.72 | |
| 10 | $ 5.57 | |||
| 25 | $ 5.42 | |||
| 50 | $ 5.12 | |||
| 100 | $ 4.82 | |||
| 300 | $ 4.52 | |||
| 600 | $ 4.37 | |||
| 1200 | $ 3.92 | |||
Description
General part information
APF30 Series
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Documents
Technical documentation and resources