Zenode.ai Logo
Beta
K
APF30-30-13CB - APF30-30-13CB

APF30-30-13CB

Active
Tusonix a Subsidiary of CTS Electronic Components

HEATSINK LOW-PROFILE FORGED

Deep-Dive with AI

Search across all available documentation for this part.

APF30-30-13CB - APF30-30-13CB

APF30-30-13CB

Active
Tusonix a Subsidiary of CTS Electronic Components

HEATSINK LOW-PROFILE FORGED

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationAPF30-30-13CB
Attachment MethodThermal Tape, Adhesive (Not Included)
Fin Height [z]12.7 mm
Fin Height [z]0.5 in
Length [x]30 mm
Length [x]1.181 in
MaterialAluminum
Material FinishBlack Anodized
Package CooledASIC, BGA, LGA, CPU
ShapeSquare, Fins
Thermal Resistance @ Forced Air Flow200 LFM, 2.5 °C/W
TypeTop Mount
Width30 mm
Width1.181 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBox 1$ 5.72
10$ 5.57
25$ 5.42
50$ 5.12
100$ 4.82
300$ 4.52
600$ 4.37
1200$ 3.92

Description

General part information

APF30 Series

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Documents

Technical documentation and resources