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APF30-30-06CB - APF30-30-06CB

APF30-30-06CB

Active
Tusonix a Subsidiary of CTS Electronic Components

HEATSINK LOW-PROFILE FORGED

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APF30-30-06CB - APF30-30-06CB

APF30-30-06CB

Active
Tusonix a Subsidiary of CTS Electronic Components

HEATSINK LOW-PROFILE FORGED

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationAPF30-30-06CB
Attachment MethodThermal Tape, Adhesive (Not Included)
Fin Height [z]6.35 mm
Fin Height [z]0.25 in
Length [x]30 mm
Length [x]1.181 in
MaterialAluminum
Material FinishBlack Anodized
Package CooledASIC, BGA, LGA, CPU
ShapeSquare, Fins
Thermal Resistance @ Forced Air Flow4.4 °C/W, 200 LFM
TypeTop Mount
Width30 mm
Width1.181 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBox 1$ 6.33
10$ 6.16
25$ 5.82
50$ 5.48
100$ 5.14
250$ 4.79
500$ 4.45
1000$ 4.37

Description

General part information

APF30 Series

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Documents

Technical documentation and resources