Zenode.ai Logo
Beta
K

84-PGM13042-50

Active
Aries Electronics

CONN SOCKET PGA GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

84-PGM13042-50

Active
Aries Electronics

CONN SOCKET PGA GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification84-PGM13042-50
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length0.165 in
Termination Post Length4.19 mm
TypePGA

84-PGM1 Series

PartTypeOperating Temperature [Min]Operating Temperature [Max]TerminationContact Finish - PostMounting TypeMaterial Flammability RatingContact Material - Post [custom]Contact Finish Thickness - MatingContact Finish Thickness - MatingHousing MaterialContact Finish Thickness - PostContact Finish Thickness - PostTermination Post LengthTermination Post LengthContact Material - MatingPitch - MatingPitch - MatingPitch - PostPitch - PostContact Finish - MatingCurrent Rating (Amps)
Aries Electronics
PGA
-55 °C
125 °C
Solder
Gold
Through Hole
UL94 V-0
Brass
10 çin
0.25 çm
Glass Filled
Nylon 4/6
Polyamide (PA46)
10 çin
0.25 çm
0.165 in
4.19 mm
Beryllium Copper
0.1 in
2.54 mm
2.54 mm
0.1 in
Gold
3 A
Aries Electronics
PGA
-55 °C
105 ░C
Solder
Tin
Through Hole
UL94 V-0
Brass
10 çin
0.25 çm
Glass Filled
Nylon 4/6
Polyamide (PA46)
200 µin
5.08 µm
0.165 in
4.19 mm
Beryllium Copper
0.1 in
2.54 mm
2.54 mm
0.1 in
Gold
3 A
Aries Electronics
PGA
-55 °C
105 ░C
Solder
Tin
Through Hole
UL94 V-0
Brass
10 çin
0.25 çm
Glass Filled
Nylon 4/6
Polyamide (PA46)
200 µin
5.08 µm
0.165 in
4.19 mm
Beryllium Copper
0.1 in
2.54 mm
2.54 mm
0.1 in
Gold
3 A
Aries Electronics
PGA
-55 °C
105 ░C
Solder
Tin
Through Hole
UL94 V-0
Brass
10 çin
0.25 çm
Glass Filled
Nylon 4/6
Polyamide (PA46)
200 µin
5.08 µm
0.165 in
4.19 mm
Beryllium Copper
0.1 in
2.54 mm
2.54 mm
0.1 in
Gold
3 A
Aries Electronics
PGA
-55 °C
105 ░C
Solder
Tin
Through Hole
UL94 V-0
Brass
10 çin
0.25 çm
Glass Filled
Nylon 4/6
Polyamide (PA46)
200 µin
5.08 µm
0.165 in
4.19 mm
Beryllium Copper
0.1 in
2.54 mm
2.54 mm
0.1 in
Gold
3 A
Aries Electronics
PGA
-55 °C
105 ░C
Solder
Tin
Through Hole
UL94 V-0
Brass
10 çin
0.25 çm
Glass Filled
Nylon 4/6
Polyamide (PA46)
200 µin
5.08 µm
0.165 in
4.19 mm
Beryllium Copper
0.1 in
2.54 mm
2.54 mm
0.1 in
Gold
3 A

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 21$ 20.42

Description

General part information

84-PGM1 Series

Pos PGA Socket Gold Through Hole

Documents

Technical documentation and resources