84-PGM13053-10

Active

Aries Electronics

CONN SOCKET PGA GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

84-PGM13053-10

Active

Aries Electronics

CONN SOCKET PGA GOLD

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	84-PGM13053-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.165 in
Termination Post Length	4.19 mm
Type	PGA

84-PGM1 Series

Part	Type	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Contact Finish - Post	Mounting Type	Material Flammability Rating	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Contact Finish - Mating	Current Rating (Amps)
Aries Electronics 84-PGM11010-41	PGA	-55 °C	125 °C	Solder	Gold	Through Hole	UL94 V-0	Brass	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	0.165 in	4.19 mm	Beryllium Copper	0.1 in	2.54 mm	2.54 mm	0.1 in	Gold	3 A
Aries Electronics 84-PGM13042-50	PGA	-55 °C	105 ░C	Solder	Tin	Through Hole	UL94 V-0	Brass	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	0.165 in	4.19 mm	Beryllium Copper	0.1 in	2.54 mm	2.54 mm	0.1 in	Gold	3 A
Aries Electronics 84-PGM13053-50	PGA	-55 °C	105 ░C	Solder	Tin	Through Hole	UL94 V-0	Brass	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	0.165 in	4.19 mm	Beryllium Copper	0.1 in	2.54 mm	2.54 mm	0.1 in	Gold	3 A
Aries Electronics 84-PGM10003-10	PGA	-55 °C	105 ░C	Solder	Tin	Through Hole	UL94 V-0	Brass	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	0.165 in	4.19 mm	Beryllium Copper	0.1 in	2.54 mm	2.54 mm	0.1 in	Gold	3 A
Aries Electronics 84-PGM13053-10	PGA	-55 °C	105 ░C	Solder	Tin	Through Hole	UL94 V-0	Brass	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	0.165 in	4.19 mm	Beryllium Copper	0.1 in	2.54 mm	2.54 mm	0.1 in	Gold	3 A
Aries Electronics 84-PGM11010-10	PGA	-55 °C	105 ░C	Solder	Tin	Through Hole	UL94 V-0	Brass	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	0.165 in	4.19 mm	Beryllium Copper	0.1 in	2.54 mm	2.54 mm	0.1 in	Gold	3 A

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	34	$ 11.16

Description

General part information

84-PGM1 Series

Pos PGA Socket Gold Through Hole

Documents

Technical documentation and resources