40-6518-10

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Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

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Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	40-6518-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Number of Positions or Pins (Grid) [custom]	20
Number of Positions or Pins (Grid) [custom]	2
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	DIP
Type	0.6 in
Type	15.24 mm

Part	Housing Material	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Type	Contact Material - Mating	Contact Finish - Mating	Contact Material - Post [custom]	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Pitch - Post	Pitch - Post	Current Rating (Amps)	Termination Post Length	Termination Post Length	Contact Finish - Post	Material Flammability Rating	Pitch - Mating	Pitch - Mating
Aries Electronics 40-6518-11	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Beryllium Copper	Gold	Brass	Solder	10 çin	0.25 çm	Through Hole	40	20	2	2.54 mm	0.1 in	3 A	3.18 mm	0.125 in	Gold	UL94 V-0	0.1 in	2.54 mm
Aries Electronics 40-6518-10	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Beryllium Copper	Gold	Brass	Solder	200 µin	5.08 µm	Through Hole	40	20	2	2.54 mm	0.1 in	3 A	3.18 mm	0.125 in	Tin	UL94 V-0	0.1 in	2.54 mm
Aries Electronics 40-6518-11H	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Beryllium Copper	Gold	Brass	Solder	10 çin	0.25 çm	Through Hole	40	20	2	2.54 mm	0.1 in	3 A	3.18 mm	0.125 in	Gold	UL94 V-0	0.1 in	2.54 mm
Aries Electronics 40-6518-10H	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Beryllium Copper	Gold	Brass	Solder	200 µin	5.08 µm	Through Hole	40	20	2	2.54 mm	0.1 in	3 A	3.18 mm	0.125 in	Tin	UL94 V-0	0.1 in	2.54 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

40 (2 x 20) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources