40-6518 Series

Catalog

CONN IC DIP SOCKET 40POS GOLD

Part	Current Rating	Termination Post Length	Material Flammability Rating	Contact Material - Mating	Contact Finish - Mating	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Mounting Type	Contact Finish Thickness - Mating	Row Spacing	Type	Contact Finish Thickness - Post	Contact Material - Post	Pitch - Post	Termination	Housing Material	Pitch - Mating	Features	Contact Finish - Post
Aries Electronics 40-6518-11	3 A	0.125 in	UL94 V-0	Beryllium Copper	Gold	20	40	2	Through Hole	10 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	10 µin	Brass	0.1 in	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	Open Frame	Gold
Aries Electronics 40-6518-10	3 A	0.125 in	UL94 V-0	Beryllium Copper	Gold	20	40	2	Through Hole	10 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	200 µin	Brass	0.1 in	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	Open Frame	Tin
Aries Electronics 40-6518-11H	3 A	0.125 in	UL94 V-0	Beryllium Copper	Gold	20	40	2	Through Hole	10 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	10 µin	Brass	0.1 in	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	Open Frame	Gold
Aries Electronics 40-6518-10H	3 A	0.125 in	UL94 V-0	Beryllium Copper	Gold	20	40	2	Through Hole	10 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	200 µin	Brass	0.1 in	Solder	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	Open Frame	Tin