40-6518 Series

Catalog

CONN IC DIP SOCKET 40POS GOLD

Part	Housing Material	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Type	Contact Material - Mating	Contact Finish - Mating	Contact Material - Post [custom]	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Pitch - Post	Pitch - Post	Current Rating (Amps)	Termination Post Length	Termination Post Length	Contact Finish - Post	Material Flammability Rating	Pitch - Mating	Pitch - Mating
Aries Electronics 40-6518-11	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Beryllium Copper	Gold	Brass	Solder	10 çin	0.25 çm	Through Hole	40	20	2	2.54 mm	0.1 in	3 A	3.18 mm	0.125 in	Gold	UL94 V-0	0.1 in	2.54 mm
Aries Electronics 40-6518-10	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Beryllium Copper	Gold	Brass	Solder	200 µin	5.08 µm	Through Hole	40	20	2	2.54 mm	0.1 in	3 A	3.18 mm	0.125 in	Tin	UL94 V-0	0.1 in	2.54 mm
Aries Electronics 40-6518-11H	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Beryllium Copper	Gold	Brass	Solder	10 çin	0.25 çm	Through Hole	40	20	2	2.54 mm	0.1 in	3 A	3.18 mm	0.125 in	Gold	UL94 V-0	0.1 in	2.54 mm
Aries Electronics 40-6518-10H	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Beryllium Copper	Gold	Brass	Solder	200 µin	5.08 µm	Through Hole	40	20	2	2.54 mm	0.1 in	3 A	3.18 mm	0.125 in	Tin	UL94 V-0	0.1 in	2.54 mm