Technical Specifications
Parameters and characteristics for this part
| Specification | ICF-324-STL-I |
|---|---|
| Contact Finish - Post | Tin |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Features | Open Frame |
| Housing Material | Liquid Crystal Polymer (LCP) |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) | 24 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Type | 0.3 " |
| Type | 7.62 mm |
| Type | DIP |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
ICF Series
IC & Component Sockets ".100"" Surface Mount Screw Machine DIP Socket\/
Documents
Technical documentation and resources
