Technical Specifications
Parameters and characteristics for this part
| Specification | ICF-632-S-I-TR |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Features | Open Frame |
| Housing Material | Liquid Crystal Polymer (LCP) |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) [custom] | 2 x 16 |
| Number of Positions or Pins (Grid) [custom] | 32 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Type | DIP |
| Type | 0.6 in |
| Type | 15.24 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
ICF Series
IC & Component Sockets ".100"" Surface Mount Screw Machine DIP Socket\/
Documents
Technical documentation and resources