Specification	ICF-308-F-O

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	3 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Features	Open Frame
Grid Columns	4
Grid Rows	2
Housing Material	Liquid Crystal Polymer, LCP
Mounting Type	Surface Mount
Number of Positions or Pins (Grid)	8
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.3 in
Termination	Solder
Type	DIP, 0.3" (7.62mm) Row Spacing

ICF Series

IC & Component Sockets ".100"" Surface Mount Screw Machine DIP Socket\/

Part	Contact Material - Mating	Row Spacing	Type	Contact Finish Thickness - Mating	Housing Material	Contact Finish - Mating	Termination	Contact Finish - Post	Pitch - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Features	Mounting Type	Contact Material - Post	Pitch - Post	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows
Samtec Inc. ICF-648-S-I	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP	30 µin	LCP Liquid Crystal Polymer	Gold	Solder	Tin	0.1 in	125 °C	-55 °C	Open Frame	Surface Mount	Beryllium Copper	0.1 in	48	24	2
Samtec Inc. ICF-314-STL-I-TR	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP		LCP Liquid Crystal Polymer	Tin	Solder	Tin	0.1 in	125 °C	-55 °C	Open Frame	Surface Mount	Beryllium Copper	0.1 in	14	7	2
Samtec Inc. ICF-314-S-O	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	30 µin	LCP Liquid Crystal Polymer	Gold	Solder	Tin	0.1 in	125 °C	-55 °C	Open Frame	Surface Mount	Beryllium Copper	0.1 in	14	7	2
Samtec Inc. ICF-328-S-O	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	30 µin	LCP Liquid Crystal Polymer	Gold	Solder	Tin	0.1 in	125 °C	-55 °C	Open Frame	Surface Mount	Beryllium Copper	0.1 in	28	14	2
Samtec Inc. ICF-320-T-O	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP		LCP Liquid Crystal Polymer	Tin	Solder	Tin	0.1 in	125 °C	-55 °C	Open Frame	Surface Mount	Beryllium Copper	0.1 in	20	10	2
Samtec Inc. ICF-316-STL-I-TR	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP		LCP Liquid Crystal Polymer	Tin	Solder	Tin	0.1 in	125 °C	-55 °C	Open Frame	Surface Mount	Beryllium Copper	0.1 in	16	8	2
Samtec Inc. ICF-628-STL-O	Beryllium Copper	0.6 in	0.6" (15.24mm) Row Spacing DIP		LCP Liquid Crystal Polymer	Tin	Solder	Tin	0.1 in	125 °C	-55 °C	Open Frame	Surface Mount	Beryllium Copper	0.1 in	28	14	2
Samtec Inc. ICF-324-STL-I-TR	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP		LCP Liquid Crystal Polymer	Tin	Solder	Tin	0.1 in	125 °C	-55 °C	Open Frame	Surface Mount	Beryllium Copper	0.1 in	24	12	2
Samtec Inc. ICF-308-F-O	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	3 µin	LCP Liquid Crystal Polymer	Gold	Solder	Tin	0.1 in	125 °C	-55 °C	Open Frame	Surface Mount	Beryllium Copper	0.1 in	8	4	2
Samtec Inc. ICF-324-F-O	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	3 µin	LCP Liquid Crystal Polymer	Gold	Solder	Tin	0.1 in	125 °C	-55 °C	Open Frame	Surface Mount	Beryllium Copper	0.1 in	24	12	2

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Dimensional Drawing, Footprint, and Part Number Configuration