XR2C-0311-N

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Omron Electronics Inc-EMC Div

CONN SOCKET SIP 3POS GOLD

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XR2C-0311-N

Active

Omron Electronics Inc-EMC Div

CONN SOCKET SIP 3POS GOLD

Deep-Dive with AI

DocumentsDatasheet How to Read Date Codes

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 0.61
		10	$ 0.53
		25	$ 0.48
		50	$ 0.46
		100	$ 0.44
		250	$ 0.40
		500	$ 0.38
		1000	$ 0.31
		3000	$ 0.28

Description

General part information

XR2C Series

3 (1 x 3) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources

Datasheet

How to Read Date Codes

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	XR2C-0311-N	XR2C Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	10 çin	10 - 30 çin
Contact Finish Thickness - Mating	0.25 çm	0.25 - 0.76 çm
Contact Finish Thickness - Post	10 çin	10 - 30 çin
Contact Finish Thickness - Post	0.25 çm	0.25 - 0.76 çm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Material - Post	-	Brass
Contact Resistance	20 mOhm	20 mOhm
Current Rating (Amps)	1 A	1 A
Features	Closed Frame	Closed Frame
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole, Threaded
Number of Positions or Pins (Grid)	3	3 - 15
Number of Positions or Pins (Grid)	-	1 x 32
Number of Positions or Pins (Grid)	-	32
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.2 mm	3.2 mm
Termination Post Length	0.126 in	0.126 in
Termination Post Length	-	0.138 in
Termination Post Length	-	3.5 mm
Type	SIP	SIP

XR2C Series

CONN SOCKET SIP 3POS GOLD

Part	Housing Material	Contact Finish - Post	Contact Material - Mating	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions or Pins (Grid)	Mounting Type	Contact Material - Post	Termination	Contact Resistance	Pitch - Mating	Pitch - Mating	Features	Termination Post Length	Termination Post Length	Material Flammability Rating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Post [custom]	Termination Post Length [x]	Termination Post Length [x]
Omron Electronics Inc-EMC Div XR2C-0311-N	Polybutylene Terephthalate (PBT), Glass Filled	Gold	Beryllium Copper	1 A	-55 °C	125 °C	3	Through Hole	Beryllium Copper	Solder	20 mOhm	0.1 in	2.54 mm	Closed Frame	3.2 mm	0.126 in	UL94 V-0	2.54 mm	0.1 in	10 çin	0.25 çm	10 çin	0.25 çm	SIP	Gold
Omron Electronics Inc-EMC Div XR2C-1511-N	Polybutylene Terephthalate (PBT), Glass Filled	Gold	Beryllium Copper	1 A	-55 °C	125 °C	15	Through Hole	Beryllium Copper	Solder	20 mOhm	0.1 in	2.54 mm	Closed Frame	3.2 mm	0.126 in	UL94 V-0	2.54 mm	0.1 in	10 çin	0.25 çm	10 çin	0.25 çm	SIP	Gold
Omron Electronics Inc-EMC Div XR2C-3215	Polybutylene Terephthalate (PBT), Glass Filled	Gold	Beryllium Copper	1 A	-55 °C	125 °C		Threaded		Solder	20 mOhm	0.1 in	2.54 mm				UL94 V-0	2.54 mm	0.1 in	10 çin	0.25 çm	10 çin	0.25 çm	SIP	Gold	1 x 32	32	Brass
Omron Electronics Inc-EMC Div XR2C1011N	Polybutylene Terephthalate (PBT), Glass Filled	Gold	Beryllium Copper	1 A	-55 °C	125 °C	10	Threaded		Solder	20 mOhm	0.1 in	2.54 mm				UL94 V-0	2.54 mm	0.1 in	10 çin	0.25 çm	10 çin	0.25 çm	SIP	Gold			Brass	0.138 in	3.5 mm
Omron Electronics Inc-EMC Div XR2C-3205	Polybutylene Terephthalate (PBT), Glass Filled	Gold	Beryllium Copper	1 A	-55 °C	125 °C		Through Hole	Beryllium Copper	Solder	20 mOhm	0.1 in	2.54 mm	Closed Frame			UL94 V-0	2.54 mm	0.1 in	30 µin	0.76 µm	30 Áin	0.76 Ám	SIP	Gold	1 x 32	32