CONN SOCKET SIP 3POS GOLD
| Part | Housing Material | Contact Finish - Post | Contact Material - Mating | Current Rating (Amps) | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions or Pins (Grid) | Mounting Type | Contact Material - Post | Termination | Contact Resistance | Pitch - Mating | Pitch - Mating | Features | Termination Post Length | Termination Post Length | Material Flammability Rating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Contact Finish - Mating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Material - Post [custom] | Termination Post Length [x] | Termination Post Length [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Omron Electronics Inc-EMC Div XR2C-0311-N | Polybutylene Terephthalate (PBT), Glass Filled | Gold | Beryllium Copper | 1 A | -55 °C | 125 °C | 3 | Through Hole | Beryllium Copper | Solder | 20 mOhm | 0.1 in | 2.54 mm | Closed Frame | 3.2 mm | 0.126 in | UL94 V-0 | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | 10 çin | 0.25 çm | SIP | Gold | |||||
Omron Electronics Inc-EMC Div XR2C-1511-N | Polybutylene Terephthalate (PBT), Glass Filled | Gold | Beryllium Copper | 1 A | -55 °C | 125 °C | 15 | Through Hole | Beryllium Copper | Solder | 20 mOhm | 0.1 in | 2.54 mm | Closed Frame | 3.2 mm | 0.126 in | UL94 V-0 | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | 10 çin | 0.25 çm | SIP | Gold | |||||
Omron Electronics Inc-EMC Div XR2C-3215 | Polybutylene Terephthalate (PBT), Glass Filled | Gold | Beryllium Copper | 1 A | -55 °C | 125 °C | Threaded | Solder | 20 mOhm | 0.1 in | 2.54 mm | UL94 V-0 | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | 10 çin | 0.25 çm | SIP | Gold | 1 x 32 | 32 | Brass | |||||||
Omron Electronics Inc-EMC Div XR2C1011N | Polybutylene Terephthalate (PBT), Glass Filled | Gold | Beryllium Copper | 1 A | -55 °C | 125 °C | 10 | Threaded | Solder | 20 mOhm | 0.1 in | 2.54 mm | UL94 V-0 | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | 10 çin | 0.25 çm | SIP | Gold | Brass | 0.138 in | 3.5 mm | ||||||
Omron Electronics Inc-EMC Div XR2C-3205 | Polybutylene Terephthalate (PBT), Glass Filled | Gold | Beryllium Copper | 1 A | -55 °C | 125 °C | Through Hole | Beryllium Copper | Solder | 20 mOhm | 0.1 in | 2.54 mm | Closed Frame | UL94 V-0 | 2.54 mm | 0.1 in | 30 µin | 0.76 µm | 30 Áin | 0.76 Ám | SIP | Gold | 1 x 32 | 32 |