L17HTHBP3F1C

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Amphenol ICC (Commercial Products)

CONN D-SUB HD PLUG 44P R/A SLDR

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L17HTHBP3F1C

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Amphenol ICC (Commercial Products)

CONN D-SUB HD PLUG 44P R/A SLDR

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	L17HTHBP3F1C

Backset Spacing	8.89 mm
Backset Spacing	0.35 in
Connector Style	High Density, D-Sub
Connector Type	Plug, Male Pins
Contact Finish	Gold
Contact Finish Thickness	Flash
Contact Form	Stamped
Contact Material	Copper Alloy
Contact Type	Signal
Current Rating (Amps)	3 A
Dielectric Material	Thermoplastic, Glass Filled
Features	Grounding Indents, Board Lock
Flange Feature	Female Screwlock (M3), Mating Side
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole, Right Angle
Number of Positions	44
Number of Rows	3
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-55 °C
Shell Size, Connector Layout [custom]	B, DB
Shell Size, Connector Layout [x]	3
Termination	Solder
Voltage Rating	300 VDC

L17HTHBP3 Series

Part	Current Rating (Amps)	Contact Type	Contact Finish	Material Flammability Rating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness	Contact Finish Thickness	Mounting Type	Flange Feature	Number of Positions	Contact Material	Contact Form	Connector Type	Termination	Voltage Rating	Dielectric Material	Number of Rows	Connector Style	Backset Spacing	Backset Spacing	Shell Size, Connector Layout [x]	Shell Size, Connector Layout [custom]	Features	Contact Finish Thickness
Amphenol ICC (Commercial Products) L17HTHBP3F2C	3 A	Signal	Gold	UL94 V-0	-55 °C	150 °C	15 µin	0.38 µm	Through Hole Right Angle	Female Screwlock (M3) Mating Side	44	Copper Alloy	Stamped	Male Pins Plug	Solder	300 VDC	Thermoplastic Glass Filled	3	D-Sub High Density	8.89 mm	0.35 in	3	B DB	Board Lock Grounding Indents
Amphenol ICC (Commercial Products) L17HTHBP3R1C	3 A	Signal	Gold	UL94 V-0	-55 °C	150 °C			Through Hole Right Angle	Board Side (M3)	44	Copper Alloy	Stamped	Male Pins Plug	Solder	300 VDC	Thermoplastic Glass Filled	3	D-Sub High Density	8.89 mm	0.35 in	3	B DB	Board Lock Grounding Indents	Flash
Amphenol ICC (Commercial Products) L17HTHBP3F1C	3 A	Signal	Gold	UL94 V-0	-55 °C	150 °C			Through Hole Right Angle	Female Screwlock (M3) Mating Side	44	Copper Alloy	Stamped	Male Pins Plug	Solder	300 VDC	Thermoplastic Glass Filled	3	D-Sub High Density	8.89 mm	0.35 in	3	B DB	Board Lock Grounding Indents	Flash
Amphenol ICC (Commercial Products) L17HTHBP3F4C	3 A	Signal	Gold	UL94 V-0	-55 °C	150 °C	30 Áin	0.76 Ám	Through Hole Right Angle	Female Screwlock (M3) Mating Side	44	Copper Alloy	Stamped	Male Pins Plug	Solder	300 VDC	Thermoplastic Glass Filled	3	D-Sub High Density	8.89 mm	0.35 in	3	B DB	Board Lock Grounding Indents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

L17HTHBP3 Series

44 Position D-Sub, High Density Plug, Male Pins Connector

Documents

Technical documentation and resources