Zenode.ai Logo
Beta
K

L17HTHBP3R1C

Active
Amphenol ICC (Commercial Products)

CONN D-SUB HD PLUG 44P R/A SLDR

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

L17HTHBP3R1C

Active
Amphenol ICC (Commercial Products)

CONN D-SUB HD PLUG 44P R/A SLDR

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationL17HTHBP3R1C
Backset Spacing8.89 mm
Backset Spacing0.35 in
Connector StyleHigh Density, D-Sub
Connector TypePlug, Male Pins
Contact FinishGold
Contact Finish ThicknessFlash
Contact FormStamped
Contact MaterialCopper Alloy
Contact TypeSignal
Current Rating (Amps)3 A
Dielectric MaterialThermoplastic, Glass Filled
FeaturesGrounding Indents, Board Lock
Flange FeatureBoard Side (M3)
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole, Right Angle
Number of Positions44
Number of Rows3
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Shell Size, Connector Layout [custom]B, DB
Shell Size, Connector Layout [x]3
TerminationSolder
Voltage Rating300 VDC

L17HTHBP3 Series

PartCurrent Rating (Amps)Contact TypeContact FinishMaterial Flammability RatingOperating Temperature [Min]Operating Temperature [Max]Contact Finish ThicknessContact Finish ThicknessMounting TypeFlange FeatureNumber of PositionsContact MaterialContact FormConnector TypeTerminationVoltage RatingDielectric MaterialNumber of RowsConnector StyleBackset SpacingBackset SpacingShell Size, Connector Layout [x]Shell Size, Connector Layout [custom]FeaturesContact Finish Thickness
Amphenol ICC (Commercial Products)
3 A
Signal
Gold
UL94 V-0
-55 °C
150 °C
15 µin
0.38 µm
Through Hole
Right Angle
Female Screwlock (M3)
Mating Side
44
Copper Alloy
Stamped
Male Pins
Plug
Solder
300 VDC
Thermoplastic
Glass Filled
3
D-Sub
High Density
8.89 mm
0.35 in
3
B
DB
Board Lock
Grounding Indents
Amphenol ICC (Commercial Products)
3 A
Signal
Gold
UL94 V-0
-55 °C
150 °C
Through Hole
Right Angle
Board Side (M3)
44
Copper Alloy
Stamped
Male Pins
Plug
Solder
300 VDC
Thermoplastic
Glass Filled
3
D-Sub
High Density
8.89 mm
0.35 in
3
B
DB
Board Lock
Grounding Indents
Flash
Amphenol ICC (Commercial Products)
3 A
Signal
Gold
UL94 V-0
-55 °C
150 °C
Through Hole
Right Angle
Female Screwlock (M3)
Mating Side
44
Copper Alloy
Stamped
Male Pins
Plug
Solder
300 VDC
Thermoplastic
Glass Filled
3
D-Sub
High Density
8.89 mm
0.35 in
3
B
DB
Board Lock
Grounding Indents
Flash
Amphenol ICC (Commercial Products)
3 A
Signal
Gold
UL94 V-0
-55 °C
150 °C
30 Áin
0.76 Ám
Through Hole
Right Angle
Female Screwlock (M3)
Mating Side
44
Copper Alloy
Stamped
Male Pins
Plug
Solder
300 VDC
Thermoplastic
Glass Filled
3
D-Sub
High Density
8.89 mm
0.35 in
3
B
DB
Board Lock
Grounding Indents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

Description

General part information

L17HTHBP3 Series

44 Position D-Sub, High Density Plug, Male Pins Connector

Documents

Technical documentation and resources