655-26ABT5

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Wakefield-Vette

HEATSINK FOR 40MM BGA

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Wakefield-Vette

HEATSINK FOR 40MM BGA

Technical Specifications

Parameters and characteristics for this part

Specification	655-26ABT5

Attachment Method	Thermal Tape, Adhesive (Not Included)
Fin Height [z]	0.26 in
Fin Height [z]	6.6 mm
Length	1.6 in
Length	40.64 mm
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Power Dissipation @ Temperature Rise	5 W
Shape	Square, Pin Fins
Thermal Resistance @ Forced Air Flow	3 °C/W, 500 LFM
Type	Top Mount
Width [x]	1.6 in
Width [x]	40.64 mm

Part	Power Dissipation @ Temperature Rise	Width [x]	Width [x]	Material Finish	Shape	Material	Package Cooled	Fin Height [z]	Fin Height [z]	Length	Length	Type	Attachment Method	Thermal Resistance @ Forced Air Flow
Wakefield-Vette 655-26ABT5	5 W	1.6 in	40.64 mm	Black Anodized	Pin Fins Square	Aluminum	ASIC BGA CPU LGA	0.26 in	6.6 mm	1.6 in	40.64 mm	Top Mount	Thermal Tape Adhesive (Not Included)	3 °C/W 500 LFM
Wakefield-Vette 655-26ABT4E	5 W	1.6 in	40.64 mm	Black Anodized	Pin Fins Square	Aluminum	ASIC BGA CPU LGA	0.26 in	6.6 mm	1.6 in	40.64 mm	Top Mount	Thermal Tape Adhesive (Not Included)	3 °C/W 500 LFM

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	500	$ 6.76

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 5.0W @ 60°C Top Mount

Technical documentation and resources