Beta
⌘K
HEATSINK FOR 40MM BGA
| Part | Power Dissipation @ Temperature Rise | Width [x] | Width [x] | Material Finish | Shape | Material | Package Cooled | Fin Height [z] | Fin Height [z] | Length | Length | Type | Attachment Method | Thermal Resistance @ Forced Air Flow |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette | 5 W | 1.6 in | 40.64 mm | Black Anodized | Pin Fins Square | Aluminum | ASIC BGA CPU LGA | 0.26 in | 6.6 mm | 1.6 in | 40.64 mm | Top Mount | Thermal Tape Adhesive (Not Included) | 3 °C/W 500 LFM |
Wakefield-Vette | 5 W | 1.6 in | 40.64 mm | Black Anodized | Pin Fins Square | Aluminum | ASIC BGA CPU LGA | 0.26 in | 6.6 mm | 1.6 in | 40.64 mm | Top Mount | Thermal Tape Adhesive (Not Included) | 3 °C/W 500 LFM |