L17HTHAP3F1C

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Amphenol ICC (Commercial Products)

CONN D-SUB HD PLUG 26P R/A SLDR

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L17HTHAP3F1C

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Amphenol ICC (Commercial Products)

CONN D-SUB HD PLUG 26P R/A SLDR

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	L17HTHAP3F1C

Backset Spacing	8.89 mm
Backset Spacing	0.35 in
Connector Style	High Density, D-Sub
Connector Type	Plug, Male Pins
Contact Finish	Gold
Contact Finish Thickness	Flash
Contact Form	Stamped
Contact Material	Copper Alloy
Contact Type	Signal
Current Rating (Amps)	3 A
Dielectric Material	Thermoplastic, Glass Filled
Features	Grounding Indents, Board Lock
Flange Feature	Female Screwlock (M3), Mating Side
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole, Right Angle
Number of Positions	26
Number of Rows	3
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-55 °C
Shell Size, Connector Layout	2
Shell Size, Connector Layout	(DA, A) High Density
Termination	Solder
Voltage Rating	300 VDC

L17HTHAP3 Series

Part	Termination	Number of Positions	Shell Size, Connector Layout	Shell Size, Connector Layout	Operating Temperature [Min]	Operating Temperature [Max]	Backset Spacing	Backset Spacing	Contact Finish Thickness	Contact Form	Voltage Rating	Contact Type	Dielectric Material	Number of Rows	Mounting Type	Connector Type	Features	Current Rating (Amps)	Contact Material	Material Flammability Rating	Connector Style	Flange Feature	Contact Finish	Contact Finish Thickness	Contact Finish Thickness
Amphenol ICC (Commercial Products) L17HTHAP3F1C	Solder	26	2	(DA A) High Density	-55 °C	150 °C	8.89 mm	0.35 in	Flash	Stamped	300 VDC	Signal	Thermoplastic Glass Filled	3	Through Hole Right Angle	Male Pins Plug	Board Lock Grounding Indents	3 A	Copper Alloy	UL94 V-0	D-Sub High Density	Female Screwlock (M3) Mating Side	Gold
Amphenol ICC (Commercial Products) L17HTHAP3R2C	Solder	26	2	(DA A) High Density	-55 °C	150 °C	8.89 mm	0.35 in		Stamped	300 VDC	Signal	Thermoplastic Glass Filled	3	Through Hole Right Angle	Male Pins Plug	Board Lock Grounding Indents	3 A	Copper Alloy	UL94 V-0	D-Sub High Density	Board Side (M3)	Gold	15 µin	0.38 µm
Amphenol ICC (Commercial Products) L17HTHAP3F2C	Solder	26	2	(DA A) High Density	-55 °C	150 °C	8.89 mm	0.35 in		Stamped	300 VDC	Signal	Thermoplastic Glass Filled	3	Through Hole Right Angle	Male Pins Plug	Board Lock Grounding Indents	3 A	Copper Alloy	UL94 V-0	D-Sub High Density	Female Screwlock (M3) Mating Side	Gold	15 µin	0.38 µm
Amphenol ICC (Commercial Products) L17HTHAP3F4C	Solder	26	2	(DA A) High Density	-55 °C	150 °C	8.89 mm	0.35 in		Stamped	300 VDC	Signal	Thermoplastic Glass Filled	3	Through Hole Right Angle	Male Pins Plug	Board Lock Grounding Indents	3 A	Copper Alloy	UL94 V-0	D-Sub High Density	Female Screwlock (M3) Mating Side	Gold	30 Áin	0.76 Ám
Amphenol ICC (Commercial Products) L17HTHAP3R4C	Solder	26	2	(DA A) High Density	-55 °C	150 °C	8.89 mm	0.35 in		Stamped	300 VDC	Signal	Thermoplastic Glass Filled	3	Through Hole Right Angle	Male Pins Plug	Board Lock Grounding Indents	3 A	Copper Alloy	UL94 V-0	D-Sub High Density	Board Side (M3)	Gold	30 Áin	0.76 Ám

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

L17HTHAP3 Series

26 Position D-Sub, High Density Plug, Male Pins Connector

Documents

Technical documentation and resources