L17HTHAP3 Series
Manufacturer: Amphenol ICC (Commercial Products)
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⌘K
CONN D-SUB HD PLUG 26P R/A SLDR
| Part | Shell Size | Connector Layout | Finish | Shell Material | Number of Rows | Contact Type | Connector Type | Backset Spacing | Contact Finish Thickness | Contact Finish Thickness (string set options) | Contact Finish Thickness | Current Rating | Termination | Flange Feature | Contact Finish | Material Flammability Rating | Features | Number of Positions | Connector Style | Mounting Type | Dielectric Material | Operating Temperature (Max) | Operating Temperature (Min) | Contact Material | Contact Form | Voltage Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Amphenol ICC (Commercial Products) | 2 | A DA High Density | Tin Plated | Steel | 3 | Signal | Male Pins Plug | 0.35 in | 0 | Flash | Flash | 3 A | Solder | Female Screwlock (M3) Mating Side | Gold | UL94 V-0 | Board Lock Grounding Indents | 26 | D-Sub High Density | Right Angle Through Hole | Glass Filled Thermoplastic | 150 °C | -55 °C | Copper Alloy | Stamped | 300 VAC/DC |
Amphenol ICC (Commercial Products) | 2 | A DA High Density | Tin Plated | Steel | 3 | Signal | Male Pins Plug | 0.35 in | 15 µin | 3 A | Solder | Board Side (M3) | Gold | UL94 V-0 | Board Lock Grounding Indents | 26 | D-Sub High Density | Right Angle Through Hole | Glass Filled Thermoplastic | 150 °C | -55 °C | Copper Alloy | Stamped | 300 VAC/DC | ||
Amphenol ICC (Commercial Products) | 2 | A DA High Density | Tin Plated | Steel | 3 | Signal | Male Pins Plug | 0.35 in | 15 µin | 3 A | Solder | Female Screwlock (M3) Mating Side | Gold | UL94 V-0 | Board Lock Grounding Indents | 26 | D-Sub High Density | Right Angle Through Hole | Glass Filled Thermoplastic | 150 °C | -55 °C | Copper Alloy | Stamped | 300 VAC/DC | ||
Amphenol ICC (Commercial Products) | 2 | A DA High Density | Tin Plated | Steel | 3 | Signal | Male Pins Plug | 0.35 in | 30 µin | 3 A | Solder | Female Screwlock (M3) Mating Side | Gold | UL94 V-0 | Board Lock Grounding Indents | 26 | D-Sub High Density | Right Angle Through Hole | Glass Filled Thermoplastic | 150 °C | -55 °C | Copper Alloy | Stamped | 300 VAC/DC | ||
Amphenol ICC (Commercial Products) | 2 | A DA High Density | Tin Plated | Steel | 3 | Signal | Male Pins Plug | 0.35 in | 30 µin | 3 A | Solder | Board Side (M3) | Gold | UL94 V-0 | Board Lock Grounding Indents | 26 | D-Sub High Density | Right Angle Through Hole | Glass Filled Thermoplastic | 150 °C | -55 °C | Copper Alloy | Stamped | 300 VAC/DC |