24-C182-00
ActiveAries Electronics
CONN IC DIP SOCKET 24POS GOLD
Deep-Dive with AI
Search across all available documentation for this part.
DocumentsDatasheet
24-C182-00
ActiveAries Electronics
CONN IC DIP SOCKET 24POS GOLD
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 24-C182-00 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Current Rating (Amps) | 3 A |
| Features | Closed Frame |
| Housing Material | Glass Filled, Polyamide (PA46), Nylon 4/6 |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) | 24 |
| Operating Temperature [Max] | 105 ░C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 0.04 in |
| Termination Post Length | 1.02 mm |
| Type | DIP |
| Type | 0.6 in |
| Type | 15.24 mm |
24-C182 Series
| Part | Number of Positions or Pins (Grid) | Pitch - Post | Pitch - Post | Contact Finish - Mating | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material | Pitch - Mating | Pitch - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Termination Post Length | Termination Post Length | Contact Finish - Post | Material Flammability Rating | Type | Type | Type | Current Rating (Amps) | Termination | Contact Material - Post [custom] | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 24 | 2.54 mm | 0.1 in | Gold | Beryllium Copper | 10 çin | 0.25 çm | Closed Frame | 200 µin | 5.08 µm | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | 105 ░C | -55 °C | 3.18 mm | 0.125 in | Tin | UL94 V-0 | DIP | 0.6 in | 15.24 mm | 3 A | Solder | Brass | Through Hole |
Aries Electronics | 24 | 2.54 mm | 0.1 in | Gold | Beryllium Copper | 10 çin | 0.25 çm | Closed Frame | 10 çin | 0.25 çm | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | 125 °C | -55 °C | 1.02 mm | 0.04 in | Gold | UL94 V-0 | DIP | 0.6 in | 15.24 mm | 3 A | Wire Wrap | Brass | Through Hole |
Aries Electronics | 24 | 2.54 mm | 0.1 in | Gold | Beryllium Copper | 10 çin | 0.25 çm | Closed Frame | 200 µin | 5.08 µm | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | 105 ░C | -55 °C | 1.02 mm | 0.04 in | Tin | UL94 V-0 | DIP | 0.6 in | 15.24 mm | 3 A | Solder | Brass | Surface Mount |
Aries Electronics | 24 | 2.54 mm | 0.1 in | Gold | Beryllium Copper | 10 çin | 0.25 çm | Closed Frame | 200 µin | 5.08 µm | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | 105 ░C | -55 °C | 1.02 mm | 0.04 in | Tin | UL94 V-0 | DIP | 0.6 in | 15.24 mm | 3 A | Wire Wrap | Brass | Through Hole |
Aries Electronics | 24 | 2.54 mm | 0.1 in | Gold | Beryllium Copper | 10 çin | 0.25 çm | Closed Frame | 200 µin | 5.08 µm | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | 105 ░C | -55 °C | 1.02 mm | 0.04 in | Tin | UL94 V-0 | DIP | 0.6 in | 15.24 mm | 3 A | Wire Wrap | Brass | Through Hole |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 41 | $ 11.27 | |
Description
General part information
24-C182 Series
24 (2 x 12) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Surface Mount
Documents
Technical documentation and resources