24-C182 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Contact Finish - Mating	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Pitch - Mating	Pitch - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Termination Post Length	Termination Post Length	Contact Finish - Post	Material Flammability Rating	Type	Type	Type	Current Rating (Amps)	Termination	Contact Material - Post [custom]	Mounting Type
Aries Electronics 24-C182-10	24	2.54 mm	0.1 in	Gold	Beryllium Copper	10 çin	0.25 çm	Closed Frame	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	105 ░C	-55 °C	3.18 mm	0.125 in	Tin	UL94 V-0	DIP	0.6 in	15.24 mm	3 A	Solder	Brass	Through Hole
Aries Electronics 24-C182-21	24	2.54 mm	0.1 in	Gold	Beryllium Copper	10 çin	0.25 çm	Closed Frame	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	125 °C	-55 °C	1.02 mm	0.04 in	Gold	UL94 V-0	DIP	0.6 in	15.24 mm	3 A	Wire Wrap	Brass	Through Hole
Aries Electronics 24-C182-00	24	2.54 mm	0.1 in	Gold	Beryllium Copper	10 çin	0.25 çm	Closed Frame	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	105 ░C	-55 °C	1.02 mm	0.04 in	Tin	UL94 V-0	DIP	0.6 in	15.24 mm	3 A	Solder	Brass	Surface Mount
Aries Electronics 24-C182-20	24	2.54 mm	0.1 in	Gold	Beryllium Copper	10 çin	0.25 çm	Closed Frame	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	105 ░C	-55 °C	1.02 mm	0.04 in	Tin	UL94 V-0	DIP	0.6 in	15.24 mm	3 A	Wire Wrap	Brass	Through Hole
Aries Electronics 24-C182-30	24	2.54 mm	0.1 in	Gold	Beryllium Copper	10 çin	0.25 çm	Closed Frame	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	105 ░C	-55 °C	1.02 mm	0.04 in	Tin	UL94 V-0	DIP	0.6 in	15.24 mm	3 A	Wire Wrap	Brass	Through Hole