Technical Specifications
Parameters and characteristics for this part
| Specification | TMM-141-01-SM-D-RA-035 |
|---|---|
| Connector Type | Header |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Length - Mating | 3.2 mm |
| Contact Length - Mating | 0.126 " |
| Contact Length - Post [x] | 0.12 in |
| Contact Length - Post [x] | 3.05 mm |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Male Pin |
| Current Rating (Amps) | 3.2 A |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 0.155 in |
| Insulation Height | 3.94 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Mounting Type | Through Hole, Right Angle |
| Number of Positions | 82 |
| Number of Positions Loaded | 81 |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating [x] | 0.079 in |
| Pitch - Mating [x] | 2 mm |
| Row Spacing - Mating | 0.079 in |
| Row Spacing - Mating | 2 mm |
| Shrouding | Unshrouded |
| Style | Board to Board, Cable |
| Termination | Solder |
TMM-141 Series
| Part | Contact Length - Mating | Contact Length - Mating | Pitch - Mating [x] | Pitch - Mating [x] | Style | Operating Temperature [Max] | Operating Temperature [Min] | Fastening Type | Number of Positions | Connector Type | Number of Positions Loaded | Contact Finish - Post | Insulation Color | Insulation Material | Contact Material | Mounting Type | Current Rating (Amps) | Number of Rows | Contact Shape | Termination | Contact Type | Shrouding | Contact Length - Post [x] | Contact Length - Post [x] | Insulation Height | Insulation Height | Number of Positions Loaded | Contact Length - Post | Contact Length - Post | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Overall Contact Length | Overall Contact Length | Row Spacing - Mating | Row Spacing - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 3.2 mm | 0.126 " | 0.079 in | 2 mm | Board to Board Cable | 105 ░C | -55 °C | Push-Pull | 41 | Header | 40 | Tin | Black | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Through Hole Right Angle | 3.2 A | 1 | Square | Solder | Male Pin | Unshrouded | 0.12 in | 3.05 mm | 0.079 in | 2 mm | ||||||||||||
Samtec Inc. | 3.2 mm | 0.126 " | 0.079 in | 2 mm | Board to Board Cable | 125 °C | -55 °C | Push-Pull | 41 | Header | Gold | Black | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Through Hole | 3.2 A | 1 | Square | Solder | Male Pin | Unshrouded | 0.059 " | 1.5 mm | All | 3.5 mm | 0.138 in | Gold | 3 µin | 0.076 µm | 0.51 µm | 20 µin | 8.2 mm | 0.323 in | |||||
Samtec Inc. | 3.2 mm | 0.126 " | 0.079 in | 2 mm | Board to Board Cable | 105 ░C | -55 °C | Push-Pull | 41 | Header | Tin | Black | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Through Hole | 3.2 A | 1 | Square | Solder | Male Pin | Unshrouded | 0.059 " | 1.5 mm | All | 3.5 mm | 0.138 in | 8.2 mm | 0.323 in | ||||||||||
Samtec Inc. | 3.2 mm | 0.126 " | 0.079 in | 2 mm | Board to Board Cable | 125 °C | -55 °C | Push-Pull | 82 | Header | Gold | Black | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Through Hole | 3.2 A | 2 | Square | Solder | Male Pin | Unshrouded | 0.059 " | 1.5 mm | All | 3.5 mm | 0.138 in | Gold | 3 µin | 0.076 µm | 0.51 µm | 20 µin | 8.2 mm | 0.323 in | 0.079 in | 2 mm | |||
Samtec Inc. | 3.2 mm | 0.126 " | 0.079 in | 2 mm | Board to Board Cable | 125 °C | -55 °C | Push-Pull | 82 | Header | 81 | Tin | Black | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Through Hole Right Angle | 3.2 A | 2 | Square | Solder | Male Pin | Unshrouded | 0.12 in | 3.05 mm | 0.155 in | 3.94 mm | Gold | 0.76 Ám | 30 Áin | 0.079 in | 2 mm | |||||||
Samtec Inc. | 3.2 mm | 0.126 " | 0.079 in | 2 mm | Board to Board Cable | 125 °C | -55 °C | Push-Pull | 82 | Header | 81 | Tin | Black | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Through Hole Right Angle | 3.2 A | 2 | Square | Solder | Male Pin | Unshrouded | 0.12 in | 3.05 mm | 0.155 in | 3.94 mm | Gold | 0.76 Ám | 30 Áin | 0.079 in | 2 mm | |||||||
Samtec Inc. | 3.2 mm | 0.126 " | 0.079 in | 2 mm | Board to Board Cable | 125 °C | -55 °C | Push-Pull | 82 | Header | 81 | Gold | Black | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Through Hole Right Angle | 3.2 A | 2 | Square | Solder | Male Pin | Unshrouded | 0.12 in | 3.05 mm | 0.155 in | 3.94 mm | Gold | 3 µin | 0.076 µm | 0.51 µm | 20 µin | 0.079 in | 2 mm | |||||
Samtec Inc. | 3.2 mm | 0.126 " | 0.079 in | 2 mm | Board to Board Cable | 125 °C | -55 °C | Push-Pull | 41 | Header | 40 | Tin | Black | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Through Hole Right Angle | 3.2 A | 1 | Square | Solder | Male Pin | Unshrouded | 0.12 in | 3.05 mm | 0.079 in | 2 mm | Gold | 0.076 µm | 3 µin | |||||||||
Samtec Inc. | 3.2 mm | 0.126 " | 0.079 in | 2 mm | Board to Board Cable | 105 ░C | -55 °C | Push-Pull | 41 | Header | 40 | Tin | Black | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Through Hole Right Angle | 3.2 A | 1 | Square | Solder | Male Pin | Unshrouded | 0.12 in | 3.05 mm | 0.079 in | 2 mm | ||||||||||||
Samtec Inc. | 3.2 mm | 0.126 " | 0.079 in | 2 mm | Board to Board Cable | 125 °C | -55 °C | Push-Pull | 41 | Header | Tin | Black | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Through Hole | 3.2 A | 1 | Square | Solder | Male Pin | Unshrouded | 0.059 " | 1.5 mm | All | 3.5 mm | 0.138 in | Gold | 0.76 Ám | 30 Áin | 8.2 mm | 0.323 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
TMM-141 Series
Connector Header Through Hole, Right Angle 82 position 0.079" (2.00mm)
Documents
Technical documentation and resources
