TMM-141 Series
Manufacturer: Samtec Inc.
2MM TERMINAL STRIP
| Part | Pitch - Mating | Fastening Type | Number of Positions Loaded | Contact Shape | Mounting Type | Contact Length - Mating | Shrouding | Contact Finish - Post | Contact Finish - Mating | Insulation Height | Contact Type | Current Rating (Per Contact) | Insulation Material | Number of Rows | Style | Contact Material | Contact Length - Post | Termination | Insulation Color | Number of Positions | Connector Type | Operating Temperature (Min) | Operating Temperature (Max) | Overall Contact Length | Contact Finish Thickness - Mating | Number of Positions Loaded | Contact Finish Thickness - Post | Row Spacing - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.079 in | Push-Pull | 40 | Square | Right Angle Through Hole | 0.126 in | Unshrouded | Tin | Tin | 0.079 in | Male Pin | 3.2 A | Liquid Crystal Polymer (LCP) | 1 | Board Board or Cable | Phosphor Bronze | 0.12 in | Solder | Black | 41 | Header | -55 °C | 105 °C | |||||
Samtec Inc. | 0.079 in | Push-Pull | Square | Through Hole | 0.126 in | Unshrouded | Gold | Gold | 0.059 in | Male Pin | 3.2 A | Liquid Crystal Polymer (LCP) | 1 | Board Board or Cable | Phosphor Bronze | 0.138 in | Solder | Black | 41 | Header | -55 °C | 125 °C | 0.323 in | 20 Ąin | All | 3 µin | ||
Samtec Inc. | 0.079 in | Push-Pull | Square | Through Hole | 0.126 in | Unshrouded | Tin | Tin | 0.059 in | Male Pin | 3.2 A | Liquid Crystal Polymer (LCP) | 1 | Board Board or Cable | Phosphor Bronze | 0.138 in | Solder | Black | 41 | Header | -55 °C | 105 °C | 0.323 in | All | ||||
Samtec Inc. | 0.079 in | Push-Pull | Square | Through Hole | 0.126 in | Unshrouded | Gold | Gold | 0.059 in | Male Pin | 3.2 A | Liquid Crystal Polymer (LCP) | 2 | Board Board or Cable | Phosphor Bronze | 0.138 in | Solder | Black | 82 | Header | -55 °C | 125 °C | 0.323 in | 20 Ąin | All | 3 µin | 0.079 in | |
Samtec Inc. | 0.079 in | Push-Pull | 81 | Square | Right Angle Through Hole | 0.126 in | Unshrouded | Tin | Gold | 0.155 in | Male Pin | 3.2 A | Liquid Crystal Polymer (LCP) | 2 | Board Board or Cable | Phosphor Bronze | 0.12 in | Solder | Black | 82 | Header | -55 °C | 125 °C | 30 µin | 0.079 in | |||
Samtec Inc. | 0.079 in | Push-Pull | 81 | Square | Right Angle Through Hole | 0.126 in | Unshrouded | Gold | Gold | 0.155 in | Male Pin | 3.2 A | Liquid Crystal Polymer (LCP) | 2 | Board Board or Cable | Phosphor Bronze | 0.12 in | Solder | Black | 82 | Header | -55 °C | 125 °C | 20 Ąin | 3 µin | 0.079 in | ||
Samtec Inc. | 0.079 in | Push-Pull | 40 | Square | Right Angle Through Hole | 0.126 in | Unshrouded | Tin | Gold | 0.079 in | Male Pin | 3.2 A | Liquid Crystal Polymer (LCP) | 1 | Board Board or Cable | Phosphor Bronze | 0.12 in | Solder | Black | 41 | Header | -55 °C | 125 °C | 3 µin | ||||
Samtec Inc. | 0.079 in | Push-Pull | 40 | Square | Right Angle Through Hole | 0.126 in | Unshrouded | Tin | Tin | 0.079 in | Male Pin | 3.2 A | Liquid Crystal Polymer (LCP) | 1 | Board Board or Cable | Phosphor Bronze | 0.12 in | Solder | Black | 41 | Header | -55 °C | 105 °C | |||||
Samtec Inc. | 0.079 in | Push-Pull | Square | Through Hole | 0.126 in | Unshrouded | Tin | Gold | 0.059 in | Male Pin | 3.2 A | Liquid Crystal Polymer (LCP) | 1 | Board Board or Cable | Phosphor Bronze | 0.138 in | Solder | Black | 41 | Header | -55 °C | 125 °C | 0.323 in | 30 µin | All |