IL-WX-30P-VF-B-E1000E

Active

JAE Electronics

CONN HEADER SMD 30POS 0.8MM

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

IL-WX-30P-VF-B-E1000E

Active

JAE Electronics

CONN HEADER SMD 30POS 0.8MM

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	IL-WX-30P-VF-B-E1000E

Connector Type	Header
Contact Finish - Post	Tin
Contact Length - Mating	1.8 mm
Contact Length - Mating	0.071 in
Contact Material	Brass
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	500 mA
Fastening Type	Push-Pull
Features	Solder Retention
Insulation Color	Black
Insulation Height	3.66 mm
Insulation Height	0.144 in
Insulation Material	Polyphenylene Sulfide (PPS)
Mounting Type	Surface Mount
Number of Positions	30
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Pitch - Mating	0.031 in
Pitch - Mating	0.8 mm
Row Spacing - Mating [x]	1.5 mm
Row Spacing - Mating [x]	0.059 in
Shrouding	Shrouded - 4 Wall
Termination	Solder

IL-WX-30 Series

Part	Features	Mounting Type	Pitch - Mating	Pitch - Mating	Shrouding	Number of Positions	Insulation Material	Contact Type	Contact Finish - Post	Contact Length - Mating	Contact Length - Mating	Number of Positions Loaded	Current Rating (Amps)	Connector Type	Termination	Contact Material	Contact Shape	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Insulation Color	Insulation Height	Insulation Height	Fastening Type	Operating Temperature [Max]	Operating Temperature [Min]	Number of Rows	Material Flammability Rating	Applications
JAE Electronics IL-WX-30PB-HF-B-E1000E	Board Guide Solder Retention	Surface Mount Right Angle	0.031 in	0.8 mm	Shrouded - 4 Wall	30	Polyphenylene Sulfide (PPS) Glass Filled	Male Pin	Tin	1.8 mm	0.071 in	All	500 mA	Header	Solder	Copper Alloy	Square	1.5 mm	0.059 in	Black	0.185 in	4.7 mm	Push-Pull	85 °C	-40 °C	2
JAE Electronics IL-WX-30SB-VF-BE	Board Guide Solder Retention	Surface Mount	0.031 in	0.8 mm		30	Polyphenylene Sulfide (PPS) Glass Filled	Forked				All	0.5 A	Receptacle	Solder	Copper Alloy	Square	1.5 mm	0.059 in	Black	0.128 in	3.25 mm	Push-Pull	85 °C	-40 °C	2	UL94 V-0	General Purpose
JAE Electronics IL-WX-30SB-VF-B-E1000E	Board Guide Solder Retention	Surface Mount	0.031 in	0.8 mm		30	Polyphenylene Sulfide (PPS) Glass Filled	Forked				All	0.5 A	Receptacle	Solder	Copper Alloy	Square	1.5 mm	0.059 in	Black	0.128 in	3.25 mm	Push-Pull	85 °C	-40 °C	2	UL94 V-0	General Purpose
JAE Electronics IL-WX-30P-VF-B-E1000E	Solder Retention	Surface Mount	0.031 in	0.8 mm	Shrouded - 4 Wall	30	Polyphenylene Sulfide (PPS)	Male Pin	Tin	1.8 mm	0.071 in	All	500 mA	Header	Solder	Brass	Square	1.5 mm	0.059 in	Black	0.144 in	3.66 mm	Push-Pull	85 °C	-40 °C	2
JAE Electronics IL-WX-30S-VF-B-E1000E	Solder Retention	Surface Mount	0.031 in	0.8 mm		30	Polyphenylene Sulfide (PPS) Glass Filled	Forked				All	0.5 A	Receptacle	Solder	Copper Alloy	Square	1.5 mm	0.059 in	Black	0.128 in	3.25 mm	Push-Pull	85 °C	-40 °C	2	UL94 V-0	General Purpose
JAE Electronics IL-WX-30PB-VF-A1-B-E1000	Board Guide	Surface Mount	0.031 in	0.8 mm	Shrouded - 4 Wall	30	Polyphenylene Sulfide (PPS) Glass Filled	Male Pin		1.8 mm	0.071 in	All	0.5 A	Header	Solder	Copper Alloy	Square	1.5 mm	0.059 in	Black	0.144 in	3.66 mm	Push-Pull	85 °C	-40 °C	2	UL94 V-0	General Purpose
JAE Electronics IL-WX-30PB-HF-HD-S-B-E1000E	Board Guide Solder Retention	Surface Mount Right Angle	0.031 in	0.8 mm	Shrouded - 4 Wall	30	Polyphenylene Sulfide (PPS) Glass Filled	Male Pin		1.8 mm	0.071 in	All	0.5 A	Header	Solder	Copper Alloy	Square	1.5 mm	0.059 in	Black	0.185 in	4.7 mm	Push-Pull	85 °C	-40 °C	2	UL94 V-0	General Purpose
JAE Electronics IL-WX-30P-HF-HD-S-BE	Solder Retention	Surface Mount Right Angle	0.031 in	0.8 mm	Shrouded - 4 Wall	30	Polyphenylene Sulfide (PPS) Glass Filled	Male Pin	Tin	1.8 mm	0.071 in	All	500 mA	Header	Solder	Copper Alloy	Square	1.5 mm	0.059 in	Black	0.185 in	4.7 mm	Push-Pull	85 °C	-40 °C	2
JAE Electronics IL-WX-30PB-HF-HD-S-BE	Board Guide Solder Retention	Surface Mount Right Angle	0.031 in	0.8 mm	Shrouded - 4 Wall	30	Polyphenylene Sulfide (PPS) Glass Filled	Male Pin	Tin	1.8 mm	0.071 in	All	500 mA	Header	Solder	Copper Alloy	Square	1.5 mm	0.059 in	Black	0.185 in	4.7 mm	Push-Pull	85 °C	-40 °C	2
JAE Electronics IL-WX-30P-HF-HD-S-B-E1000E	Solder Retention	Surface Mount Right Angle	0.031 in	0.8 mm	Shrouded - 4 Wall	30	Polyphenylene Sulfide (PPS) Glass Filled	Male Pin	Tin	1.8 mm	0.071 in	All	500 mA	Header	Solder	Copper Alloy	Square	1.5 mm	0.059 in	Black	0.185 in	4.7 mm	Push-Pull	85 °C	-40 °C	2

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

IL-WX-30 Series

Connector Header Surface Mount 30 position 0.031" (0.80mm)

Documents

Technical documentation and resources