CONN HEADER SMD R/A 30POS 0.8MM
| Part | Features | Mounting Type | Pitch - Mating | Pitch - Mating | Shrouding | Number of Positions | Insulation Material | Contact Type | Contact Finish - Post | Contact Length - Mating | Contact Length - Mating | Number of Positions Loaded | Current Rating (Amps) | Connector Type | Termination | Contact Material | Contact Shape | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Insulation Color | Insulation Height | Insulation Height | Fastening Type | Operating Temperature [Max] | Operating Temperature [Min] | Number of Rows | Material Flammability Rating | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
JAE Electronics | Board Guide Solder Retention | Surface Mount Right Angle | 0.031 in | 0.8 mm | Shrouded - 4 Wall | 30 | Polyphenylene Sulfide (PPS) Glass Filled | Male Pin | Tin | 1.8 mm | 0.071 in | All | 500 mA | Header | Solder | Copper Alloy | Square | 1.5 mm | 0.059 in | Black | 0.185 in | 4.7 mm | Push-Pull | 85 °C | -40 °C | 2 | ||
JAE Electronics | Board Guide Solder Retention | Surface Mount | 0.031 in | 0.8 mm | 30 | Polyphenylene Sulfide (PPS) Glass Filled | Forked | All | 0.5 A | Receptacle | Solder | Copper Alloy | Square | 1.5 mm | 0.059 in | Black | 0.128 in | 3.25 mm | Push-Pull | 85 °C | -40 °C | 2 | UL94 V-0 | General Purpose | ||||
JAE Electronics | Board Guide Solder Retention | Surface Mount | 0.031 in | 0.8 mm | 30 | Polyphenylene Sulfide (PPS) Glass Filled | Forked | All | 0.5 A | Receptacle | Solder | Copper Alloy | Square | 1.5 mm | 0.059 in | Black | 0.128 in | 3.25 mm | Push-Pull | 85 °C | -40 °C | 2 | UL94 V-0 | General Purpose | ||||
JAE Electronics | Solder Retention | Surface Mount | 0.031 in | 0.8 mm | Shrouded - 4 Wall | 30 | Polyphenylene Sulfide (PPS) | Male Pin | Tin | 1.8 mm | 0.071 in | All | 500 mA | Header | Solder | Brass | Square | 1.5 mm | 0.059 in | Black | 0.144 in | 3.66 mm | Push-Pull | 85 °C | -40 °C | 2 | ||
JAE Electronics | Solder Retention | Surface Mount | 0.031 in | 0.8 mm | 30 | Polyphenylene Sulfide (PPS) Glass Filled | Forked | All | 0.5 A | Receptacle | Solder | Copper Alloy | Square | 1.5 mm | 0.059 in | Black | 0.128 in | 3.25 mm | Push-Pull | 85 °C | -40 °C | 2 | UL94 V-0 | General Purpose | ||||
JAE Electronics | Board Guide | Surface Mount | 0.031 in | 0.8 mm | Shrouded - 4 Wall | 30 | Polyphenylene Sulfide (PPS) Glass Filled | Male Pin | 1.8 mm | 0.071 in | All | 0.5 A | Header | Solder | Copper Alloy | Square | 1.5 mm | 0.059 in | Black | 0.144 in | 3.66 mm | Push-Pull | 85 °C | -40 °C | 2 | UL94 V-0 | General Purpose | |
JAE Electronics | Board Guide Solder Retention | Surface Mount Right Angle | 0.031 in | 0.8 mm | Shrouded - 4 Wall | 30 | Polyphenylene Sulfide (PPS) Glass Filled | Male Pin | 1.8 mm | 0.071 in | All | 0.5 A | Header | Solder | Copper Alloy | Square | 1.5 mm | 0.059 in | Black | 0.185 in | 4.7 mm | Push-Pull | 85 °C | -40 °C | 2 | UL94 V-0 | General Purpose | |
JAE Electronics | Solder Retention | Surface Mount Right Angle | 0.031 in | 0.8 mm | Shrouded - 4 Wall | 30 | Polyphenylene Sulfide (PPS) Glass Filled | Male Pin | Tin | 1.8 mm | 0.071 in | All | 500 mA | Header | Solder | Copper Alloy | Square | 1.5 mm | 0.059 in | Black | 0.185 in | 4.7 mm | Push-Pull | 85 °C | -40 °C | 2 | ||
JAE Electronics | Board Guide Solder Retention | Surface Mount Right Angle | 0.031 in | 0.8 mm | Shrouded - 4 Wall | 30 | Polyphenylene Sulfide (PPS) Glass Filled | Male Pin | Tin | 1.8 mm | 0.071 in | All | 500 mA | Header | Solder | Copper Alloy | Square | 1.5 mm | 0.059 in | Black | 0.185 in | 4.7 mm | Push-Pull | 85 °C | -40 °C | 2 | ||
JAE Electronics | Solder Retention | Surface Mount Right Angle | 0.031 in | 0.8 mm | Shrouded - 4 Wall | 30 | Polyphenylene Sulfide (PPS) Glass Filled | Male Pin | Tin | 1.8 mm | 0.071 in | All | 500 mA | Header | Solder | Copper Alloy | Square | 1.5 mm | 0.059 in | Black | 0.185 in | 4.7 mm | Push-Pull | 85 °C | -40 °C | 2 |