Zenode.ai Logo
Beta
K

10-8300-210C

Active
Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

10-8300-210C

Active
Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification10-8300-210C
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Mating0.76 Ám
Contact Finish Thickness - Post10 çin
Contact Finish Thickness - Post0.25 çm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesClosed Frame, Elevated
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid) [custom]2 x 5
Number of Positions or Pins (Grid) [custom]10
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length3.56 mm
Termination Post Length0.14 in
TypeDIP
Type5.08 mm
Type0.2 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

Description

General part information

10-8300 Series

10 (2 x 5) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources