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CONN IC DIP SOCKET 10POS GOLD
| Part | Pitch - Post | Pitch - Post | Contact Finish - Post | Operating Temperature [Max] | Operating Temperature [Min] | Termination Post Length | Termination Post Length | Contact Finish - Mating | Termination | Housing Material | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Mounting Type | Contact Material - Mating | Type | Type | Type | Current Rating (Amps) | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2.54 mm | 0.1 in | Gold | 105 ░C | -55 °C | 3.56 mm | 0.14 in | Gold | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 2 x 5 | 10 | Through Hole | Beryllium Copper | DIP | 5.08 mm | 0.2 in | 3 A | Closed Frame Elevated | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Brass | 10 çin | 0.25 çm | UL94 V-0 |