
371824B00032G
ActiveBoyd Laconia, LLC
HEAT SINK, SQUARE, PCB, FOR BALL GRID ARRAYS, 31.9 °C/W, BGA, 35 MM, 7.01 MM, 35 MM

371824B00032G
ActiveBoyd Laconia, LLC
HEAT SINK, SQUARE, PCB, FOR BALL GRID ARRAYS, 31.9 °C/W, BGA, 35 MM, 7.01 MM, 35 MM
Description
General part information
371824 Series
Heat Sink BGA Aluminum 1.5W @ 50°C Top Mount
Technical Specifications
Parameters and characteristics for this part
| Specification | 371824B00032G |
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Fin Height | 0.275 in |
| Length | 1.378 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | BGA |
| Power Dissipation | 1.5 W |
| Shape | Square, Pin Fins |
| Thermal Resistance | 9.7 °C/W, 31.9 °C/W |
| Type | Top Mount |
| Width | 1.378 in |
Pricing
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CAD
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Documents
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