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371824B00032(G)

371824B00032G

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Boyd Laconia, LLC

HEAT SINK, SQUARE, PCB, FOR BALL GRID ARRAYS, 31.9 °C/W, BGA, 35 MM, 7.01 MM, 35 MM

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371824B00032(G)

371824B00032G

Active
Boyd Laconia, LLC

HEAT SINK, SQUARE, PCB, FOR BALL GRID ARRAYS, 31.9 °C/W, BGA, 35 MM, 7.01 MM, 35 MM

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Description

General part information

371824 Series

Heat Sink BGA Aluminum 1.5W @ 50°C Top Mount

Technical Specifications

Parameters and characteristics for this part

Specification371824B00032G
Attachment MethodThermal Tape, Adhesive (Included)
Fin Height0.275 in
Length1.378 in
MaterialAluminum
Material FinishBlack Anodized
Package CooledBGA
Power Dissipation1.5 W
ShapeSquare, Pin Fins
Thermal Resistance9.7 °C/W, 31.9 °C/W
TypeTop Mount
Width1.378 in

Pricing

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CAD

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