371824 Series
Manufacturer: Boyd Laconia, LLC
Beta
⌘K
HEAT SINK, SQUARE, PCB, FOR BALL GRID ARRAYS, 31.9 °C/W, BGA, 35 MM, 7.01 MM, 35 MM
| Part | Package Cooled | Material Finish | Attachment Method | Shape | Width | Material | Power Dissipation | Thermal Resistance | Fin Height | Type | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|
 Boyd Laconia, LLC | BGA | Black Anodized | Adhesive (Included) Thermal Tape | Pin Fins Square | 1.378 in | Aluminum | 1.5 W | 9.7 °C/W 31.9 °C/W | 0.275 in | Top Mount | 1.378 in |