08-2513-10
ActiveAries Electronics
CONN IC DIP SOCKET 8POS GOLD
Deep-Dive with AI
Search across all available documentation for this part.
DocumentsDatasheet
08-2513-10
ActiveAries Electronics
CONN IC DIP SOCKET 8POS GOLD
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 08-2513-10 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Current Rating (Amps) | 3 A |
| Features | Closed Frame |
| Housing Material | Glass Filled, Polyamide (PA46), Nylon 4/6 |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 8 |
| Operating Temperature [Max] | 105 ░C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 3.18 mm |
| Termination Post Length | 0.125 in |
| Type | DIP |
| Type | 5.08 mm |
| Type | 0.2 in |
08-2513 Series
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Type | Type | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] | Mounting Type | Current Rating (Amps) | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Finish - Post | Housing Material | Material Flammability Rating | Contact Material - Mating | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 105 ░C | -55 °C | DIP | 5.08 mm | 0.2 in | 8 | 0.1 in | 2.54 mm | Brass | Through Hole | 3 A | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Solder | 200 µin | 5.08 µm | Closed Frame | Tin | Glass Filled Nylon 4/6 Polyamide (PA46) | UL94 V-0 | Beryllium Copper | Gold |
Aries Electronics | 105 ░C | -55 °C | DIP | 5.08 mm | 0.2 in | 8 | 0.1 in | 2.54 mm | Brass | Through Hole | 3 A | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Solder | 200 µin | 5.08 µm | Closed Frame | Tin | Glass Filled Nylon 4/6 Polyamide (PA46) | UL94 V-0 | Beryllium Copper | Gold |
Aries Electronics | 105 ░C | -55 °C | DIP | 5.08 mm | 0.2 in | 8 | 0.1 in | 2.54 mm | Brass | Through Hole | 3 A | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Solder | 200 µin | 5.08 µm | Closed Frame | Tin | Glass Filled Nylon 4/6 Polyamide (PA46) | UL94 V-0 | Beryllium Copper | Gold |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 1.61 | |
| 10 | $ 1.40 | |||
| 100 | $ 1.25 | |||
| 1000 | $ 0.89 | |||
| 5000 | $ 0.79 | |||
| 10000 | $ 0.77 | |||
Description
General part information
08-2513 Series
8 (2 x 4) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources