08-2513 Series

Catalog

CONN IC DIP SOCKET 8POS GOLD

Part	Material Flammability Rating	Current Rating	Termination Post Length	Housing Material	Termination	Pitch - Post	Pitch - Mating	Contact Finish - Mating	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Operating Temperature (Min)	Operating Temperature (Max)	Mounting Type	Contact Finish - Post	Row Spacing	Type	Contact Material - Post	Contact Material - Mating	Grid Columns	Grid Rows	Number of Positions or Pins (Grid)
Aries Electronics 08-2513-10T	UL94 V-0	3 A	0.125 in	Glass Filled Nylon 4/6 PA46 Polyamide	Solder	0.1 in	0.1 in	Gold	Closed Frame	10 µin	200 µin	-55 °C	105 °C	Through Hole	Tin	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	Beryllium Copper	4	2	8
Aries Electronics 08-2513-10	UL94 V-0	3 A	0.125 in	Glass Filled Nylon 4/6 PA46 Polyamide	Solder	0.1 in	0.1 in	Gold	Closed Frame	10 µin	200 µin	-55 °C	105 °C	Through Hole	Tin	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	Beryllium Copper	4	2	8
Aries Electronics 08-2513-10H	UL94 V-0	3 A	0.125 in	Glass Filled Nylon 4/6 PA46 Polyamide	Solder	0.1 in	0.1 in	Gold	Closed Frame	10 µin	200 µin	-55 °C	105 °C	Through Hole	Tin	0.2 in	0.2" (5.08mm) Row Spacing DIP	Brass	Beryllium Copper	4	2	8