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CONN IC DIP SOCKET 8POS GOLD
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Type | Type | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] | Mounting Type | Current Rating (Amps) | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Finish - Post | Housing Material | Material Flammability Rating | Contact Material - Mating | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 105 ░C | -55 °C | DIP | 5.08 mm | 0.2 in | 8 | 0.1 in | 2.54 mm | Brass | Through Hole | 3 A | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Solder | 200 µin | 5.08 µm | Closed Frame | Tin | Glass Filled Nylon 4/6 Polyamide (PA46) | UL94 V-0 | Beryllium Copper | Gold |
Aries Electronics | 105 ░C | -55 °C | DIP | 5.08 mm | 0.2 in | 8 | 0.1 in | 2.54 mm | Brass | Through Hole | 3 A | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Solder | 200 µin | 5.08 µm | Closed Frame | Tin | Glass Filled Nylon 4/6 Polyamide (PA46) | UL94 V-0 | Beryllium Copper | Gold |
Aries Electronics | 105 ░C | -55 °C | DIP | 5.08 mm | 0.2 in | 8 | 0.1 in | 2.54 mm | Brass | Through Hole | 3 A | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Solder | 200 µin | 5.08 µm | Closed Frame | Tin | Glass Filled Nylon 4/6 Polyamide (PA46) | UL94 V-0 | Beryllium Copper | Gold |