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18-0503-20 - Product Image

18-0503-20

Active
Aries Electronics

18P SIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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18-0503-20 - Product Image

18-0503-20

Active
Aries Electronics

18P SIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification18-0503-20
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Mating0.76 Ám
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
Housing MaterialPolyamide (PA), Nylon, Glass Filled
Material Flammability RatingUL94 HB
Mounting TypeThrough Hole
Number of Positions or Pins (Grid) [custom]18
Number of Positions or Pins (Grid) [custom]1 x 18
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationWire Wrap
Termination Post Length [x]0.36 in
Termination Post Length [x]9.14 mm
TypeSIP

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 55$ 8.79
LCSCPiece 1$ 18.64
204$ 7.44
493$ 7.19
1003$ 7.07

Description

General part information

18-0503 Series

18 (1 x 18) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources