18-0503 Series

Catalog

18P SIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Part	Contact Finish - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Termination Post Length [x]	Termination Post Length [x]	Pitch - Mating	Pitch - Mating	Mounting Type	Material Flammability Rating	Contact Material - Mating	Current Rating (Amps)	Contact Finish - Mating	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length
Aries Electronics 18-0503-20	Tin	18	1 x 18	SIP	30 Áin	0.76 Ám	Polyamide (PA) Nylon Glass Filled	200 µin	5.08 µm	Wire Wrap	0.36 in	9.14 mm	0.1 in	2.54 mm	Through Hole	UL94 HB	Beryllium Copper	3 A	Gold	Brass	2.54 mm	0.1 in
Aries Electronics 18-0503-31	Gold	18	1 x 18	SIP	30 Áin	0.76 Ám	Polyamide (PA) Nylon Glass Filled	10 çin	0.25 çm	Wire Wrap			0.1 in	2.54 mm	Through Hole	UL94 HB	Beryllium Copper	3 A	Gold	Brass	2.54 mm	0.1 in	0.5 in	12.7 mm