0503 Series

Catalog

IC & COMPONENT SOCKETS PIN LINE COLLET SCKT WIRE WRAP 1 PIN

Part	Current Rating	Material Flammability Rating	Termination Post Length	Contact Material - Mating	Housing Material	Contact Finish - Post	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish - Mating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Termination	Mounting Type	Type	Pitch - Post	Pitch - Mating
Aries Electronics 01-0503-21	3 A	UL94 HB	0.36 in	Beryllium Copper	Glass Filled Nylon PA Polyamide	Gold	Brass	10 µin	30 µin	Gold	1	1	1	Wire Wrap	Through Hole	SIP
Aries Electronics 07-0503-21				Beryllium Copper	Glass Filled Nylon PA Polyamide	Gold	Brass	10 µin	30 µin	Gold	1	7	7	Wire Wrap	Through Hole	SIP	0.1 in	0.1 in
Aries Electronics 18-0503-20	3 A	UL94 HB	0.36 in	Beryllium Copper	Glass Filled Nylon PA Polyamide	Tin	Brass	200 µin	30 µin	Gold	1	18	18	Wire Wrap	Through Hole	SIP	0.1 in	0.1 in
Aries Electronics 09-0503-21				Beryllium Copper	Glass Filled Nylon PA Polyamide	Gold	Brass	10 µin	30 µin	Gold	1	9	9	Wire Wrap	Through Hole	SIP	0.1 in	0.1 in
Aries Electronics 25-0503-21				Beryllium Copper	Glass Filled Nylon PA Polyamide	Gold	Brass	10 µin	30 µin	Gold	1	25	25	Wire Wrap	Through Hole	SIP	0.1 in	0.1 in
Aries Electronics 21-0503-30	3 A	UL94 HB	0.5 in	Beryllium Copper	Glass Filled Nylon PA Polyamide	Tin	Brass	200 µin	30 µin	Gold	1	21	21	Wire Wrap	Through Hole	SIP	0.1 in	0.1 in
Aries Electronics 06-0503-30				Beryllium Copper	Glass Filled Nylon PA Polyamide	Tin	Brass	200 µin	30 µin	Gold	1	6	6 count	Wire Wrap	Through Hole	SIP	0.1 in	0.1 in
Aries Electronics 13-0503-21				Beryllium Copper	Glass Filled Nylon PA Polyamide	Gold	Brass	10 µin	30 µin	Gold	1	13	13	Wire Wrap	Through Hole	SIP	0.1 in	0.1 in
Aries Electronics 04-0503-30				Beryllium Copper	Glass Filled Nylon PA Polyamide	Tin	Brass	200 µin	30 µin	Gold	1	4	4	Wire Wrap	Through Hole	SIP	0.1 in	0.1 in