224-1275-19-0602J
Active3M
RECEPTACLE DIP SOCKET 24POS .6"
Deep-Dive with AI
Search across all available documentation for this part.
DocumentsDatasheet
224-1275-19-0602J
Active3M
RECEPTACLE DIP SOCKET 24POS .6"
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | 224-1275-19-0602J | 224 Series |
|---|---|---|
| Contact Finish - Mating | Gold | Gold |
| Contact Finish - Post | Gold | Gold |
| Contact Finish Thickness - Mating | 30 Áin | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám | 0.76 Ám |
| Contact Finish Thickness - Post | 30 µin | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm | 0.76 µm |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper |
| Contact Material - Post | Beryllium Copper | Beryllium Copper |
| Contact Resistance | - | 15 - 25 mOhm |
| Convert From (Adapter End) | 15.24 mm | 15.24 mm |
| Convert From (Adapter End) | DIP | DIP |
| Convert From (Adapter End) | 0.6 in | 0.6 - 7.62 mm |
| Convert From (Adapter End) | - | 0.3 in |
| Convert To (Adapter End) | 0.6 in | 0.3 - 0.6 in |
| Convert To (Adapter End) | DIP | DIP |
| Convert To (Adapter End) | 15.24 mm | 7.62 - 15.24 mm |
| Current Rating (Amps) | 1 A | 1 A |
| Features | Closed Frame | Closed Frame |
| Housing Material | Polysulfone (PSU), Glass Filled | Polysulfone (PSU), Glass Filled, Polyethersulfone (PES) |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 |
| Mounting Type | Through Hole | Through Hole, Connector |
| Number of Pins | 24 | 24 |
| Number of Positions or Pins (Grid) | - | 24 |
| Operating Temperature [Max] | 125 °C | 125 °C |
| Operating Temperature [Min] | -55 °C | -55 °C |
| Pitch - Mating | 0.1 in | 0.02 - 0.1 in |
| Pitch - Mating | 2.54 mm | 0.5 - 2.54 mm |
| Pitch - Post | 2.54 mm | 2.54 mm |
| Pitch - Post | 0.1 in | 0.1 in |
| Termination | Wire Wrap | Solder, Press-Fit, Wire Wrap |
| Termination Post Length | - | 0.11 - 0.13 in |
| Termination Post Length | - | 2.78 - 3.3 mm |
| Termination Post Length [x] | 0.62 in | 0.62 in |
| Termination Post Length [x] | 15.75 mm | 15.75 mm |
| Type | - | QFN, DIP, ZIF (ZIP) |
| Type | - | 7.62 mm |
| Type | - | 0.3 in |
224 Series
IC & COMPONENT SOCKET, 24 CONTACTS, DIP SOCKET, 2.54 MM, 224 SERIES, 7.62 MM, BERYLLIUM COPPER
| Part | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Pitch - Post | Pitch - Post | Material Flammability Rating | Mounting Type | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Contact Material - Post | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Housing Material | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Number of Pins | Termination Post Length | Termination Post Length | Type | Number of Positions or Pins (Grid) | Contact Resistance | Type | Type | Features | Termination Post Length [x] | Termination Post Length [x] | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
0.3 in | DIP | 7.62 mm | 2.54 mm | 0.1 in | UL94 V-0 | Through Hole | Gold | -55 °C | 125 °C | DIP | 0.3 in | 7.62 mm | Beryllium Copper | 1 A | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | 30 µin | 0.76 µm | Solder | 24 | ||||||||||||
Through Hole | Gold | Beryllium Copper | 0.02 in | 0.5 mm | Beryllium Copper | Polyethersulfone (PES) | Gold | Solder | 0.118 in | 3 mm | QFN | 24 | 25 mOhm | ||||||||||||||||||||||||
2.54 mm | 0.1 in | UL94 V-0 | Connector | Gold | -55 °C | 125 °C | Beryllium Copper | 1 A | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | 30 µin | 0.76 µm | Press-Fit | 0.11 in | 2.78 mm | DIP, ZIF (ZIP) | 24 | 15 mOhm | 7.62 mm | 0.3 in | Closed Frame | |||||||||||
0.6 in | DIP | 15.24 mm | 2.54 mm | 0.1 in | UL94 V-0 | Through Hole | Gold | -55 °C | 125 °C | DIP | 0.6 in | Beryllium Copper | 1 A | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | 30 µin | 0.76 µm | Wire Wrap | 24 | Closed Frame | 0.62 in | 15.75 mm | 15.24 mm | |||||||||
0.6 in | DIP | 15.24 mm | 2.54 mm | 0.1 in | UL94 V-0 | Through Hole | Gold | -55 °C | 125 °C | DIP | 0.6 in | Beryllium Copper | 1 A | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | 30 µin | 0.76 µm | Solder | 24 | 0.13 in | 3.3 mm | Closed Frame | 15.24 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Box | 1 | $ 33.87 | |
| 10 | $ 29.66 | |||
| 30 | $ 28.38 | |||
| 50 | $ 27.46 | |||
| 100 | $ 26.55 | |||
| 250 | $ 25.08 | |||
Description
General part information
224 Series
IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
Documents
Technical documentation and resources