DS34S132GN
ActiveAnalog Devices Inc./Maxim Integrated
IC TELECOM INTERFACE 676TEPBGA
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DS34S132GN
ActiveAnalog Devices Inc./Maxim Integrated
IC TELECOM INTERFACE 676TEPBGA
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | DS34S132GN | DS34S132 Series |
|---|---|---|
| Function | TDM-over-Packet (TDMoP) | TDM-over-Packet (TDMoP) |
| Interface | TDMoP | TDMoP |
| Mounting Type | Surface Mount | Surface Mount |
| Number of Circuits | 1 | 1 |
| Operating Temperature [Max] | 85 °C | 85 °C |
| Operating Temperature [Min] | -40 °C | -40 °C |
| Package / Case | 676-BGA | 676-BGA |
| Supplier Device Package | 676-TEPBGA (27x27) | 676-TEPBGA (27x27) |
| Voltage - Supply | 1.8 V, 3.3 V | 1.8 - 3.3 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
DS34S132 Series
IC TELECOM INTERFACE 676TEPBGA
| Part | Number of Circuits | Package / Case | Interface | Function | Operating Temperature [Max] | Operating Temperature [Min] | Voltage - Supply | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|
Analog Devices Inc./Maxim Integrated DS34S132GN | 1 | 676-BGA | TDMoP | TDM-over-Packet (TDMoP) | 85 °C | -40 °C | 1.8 V, 3.3 V | Surface Mount | 676-TEPBGA (27x27) |
Analog Devices Inc./Maxim Integrated DS34S132GNA2+ | 1 | 676-BGA | TDMoP | TDM-over-Packet (TDMoP) | 85 °C | -40 °C | 1.8 V, 3.3 V | Surface Mount | 676-TEPBGA (27x27) |
Description
General part information
DS34S132 Series
Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)
Documents
Technical documentation and resources