IC TELECOM INTERFACE 676TEPBGA
| Part | Number of Circuits | Package / Case | Interface | Function | Operating Temperature [Max] | Operating Temperature [Min] | Voltage - Supply | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|
Analog Devices Inc./Maxim Integrated DS34S132GN | 1 | 676-BGA | TDMoP | TDM-over-Packet (TDMoP) | 85 °C | -40 °C | 1.8 V, 3.3 V | Surface Mount | 676-TEPBGA (27x27) |
Analog Devices Inc./Maxim Integrated DS34S132GNA2+ | 1 | 676-BGA | TDMoP | TDM-over-Packet (TDMoP) | 85 °C | -40 °C | 1.8 V, 3.3 V | Surface Mount | 676-TEPBGA (27x27) |